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Synthesis and Properties of Barium Titanate Thin Films Deposited on Copper Foil Substrates

Published online by Cambridge University Press:  26 February 2011

Jon Ihlefeld ,
William Borland  and
Jon-Paul Maria
Jon Ihlefeld
Affiliation:
[email protected], North Carolina State University, 1001 Capability Drive, Rm. 324 Research Building I, Campus Box 7917, Raleigh, North Carolina, 27606, United States
William Borland
Affiliation:
[email protected], DuPont Electronic Technologies
Jon-Paul Maria
Affiliation:
[email protected], North Carolina State University, Materials Science and Engineering
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Abstract

Barium titanate thin films have been deposited on copper foils in the absence of interfacial layers via a chemical solution process. The dielectric – base metal stacks have been processed in reductive atmospheres such that substrate oxidation is avoided while allowing the perovskite film phase to crystallize. This accomplishment has facilitated the pursuit of a new embedded capacitor technology offering compatibility with polymer printed wiring boards and capacitance densities in excess of 2.5 µF/cm2. This represents a distinct improvement beyond conventional foil-based capacitor strategies. Finally, two critical phenomena will be discussed: (1) the effect of grain size on the dielectric properties of barium titanate thin films and (2) the effect of the B-site substituent Zr on the lattice, microstructure, and dielectric properties. Most importantly, high processing temperatures have allowed for microstructural and dielectric properties similar to well-prepared bulk ceramics, including average grain diameters greater than 0.1 µm, relative permittivities in excess of 2000, and coercive fields below 10 kV/cm. These properties will be discussed in the context of bulk ceramic and thin film reference data and with regard to integration into printed wiring boards.

Keywords

ferroelectricfilmCu
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 902: Symposium T – Ferroelectric Thin Films XIII , 2005 , 0902-T02-03
Copyright
Copyright © Materials Research Society 2006

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