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The Effects of SI Addition on the Properties of AICu Films used in Multilevel Metal Systems
Published online by Cambridge University Press: 25 February 2011
Abstract
This paper reports a systematic study of the properties of Al(Cu 0.5-1.5%) and Al(Cu 0.5-1.5%, Si 0.5-1.5%)alloys. The effects of deposition temperatures ranging from room temperature to 475°C were studied as well as whether the films were deposited on Ti-W or SiO2. The Cu and Si profiles were measured as well as the presence of Al2Cu and Si precipitates. The effects of post deposition bake treatments are also discussed.
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- Copyright © Materials Research Society 1990
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