Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-28T15:44:14.787Z Has data issue: false hasContentIssue false
  • English
  • Français

The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior

Published online by Cambridge University Press:  10 February 2011

Samantha Lee ,
John C. Bravman ,
Paul A. Flinn  and
Tom N. Marieb
Samantha Lee
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
John C. Bravman
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
Paul A. Flinn
Affiliation:
Department of Materials Science & Engineering, Stanford University, Stanford, CA 94305
Tom N. Marieb
Affiliation:
Components Research, Intel Corp., Santa Clara, CA
Get access

Abstract

The electromigration behavior of pure Al lines passivated with oxides of different thicknesses and passivation deposition temperatures was studied. The initial hydrostatic stress states of the passivated Al lines were modeled with finite element modeling (FEM), and, when possible, measured with X-ray diffraction. Conventional wafer-level electromigration tests showed a clear passivation thickness effect, but no detectable effect of initial stress on electromigration lifetimes. Increasing the passivation thickness increased the electromigration lifetimes, which has been observed by other researchers. However, in a sample set where the Al lines were covered with a thin (0. 1µm) oxide layer, the lifetimes were much longer than expected. Differences in the damage morphology and the failure mechanism between the thin and thicker oxides accounted for this unexpected result.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 249
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Sauter, A. and Nix, W. D., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15, 4, p. 597–600 (1992).10.1109/33.159891Google Scholar
2. Nielen, H., Gobel, H., Eppler, I., Schroeder, H., and Schilling, W., MRS Symp. Proc. 473, 435–40 (1997).10.1557/PROC-473-435Google Scholar
3. Lloyd, J. R. and Smith, P. M., J. Vac. Sci. Technol. A 1 (2), pp. 455–458 (1983).Google Scholar
4. Yau, L., Hong, C., and Crook, D. in Proceedings IRPS 23, pp. 115–118 (1985).Google Scholar
5. Graas, C.D. and Ting, L.L., MRS Symp. Proc. 338, 429–34 (1994).10.1557/PROC-338-429Google Scholar
6. Lee, S., Bravman, J., Flinn, P., and Marieb, T., MRS Symp. Proc. 473, 415–20 (1997).10.1557/PROC-473-415Google Scholar
7. Madden, M.C., Abratowski, E.V., Marieb, T., and Flinn, P.A., MRS Symp. Proc. 265, 33–38 (1992).Google Scholar
8. Doan, J., Bravman, J., Flinn, P., and Marieb, T., in this volume.Google Scholar
9. Shatzkes, M. and Lloyd, J. R., Journal of Applied Physics, 59 (11), p. 3890–3893 (1986).Google Scholar
10. Korhonen, M.A., Borgesen, P., Tu, K.N., and Li, C.Y., Journal of Applied Physics, 73 (8), p. 3790–3799 (1993).10.1063/1.354073Google Scholar
11. Korhonen, M.A., Borgesen, P., Brown, D.D., Li, C.Y. in Journal of Applied Physics, 74 (8), p. 4995–5004 (1993).10.1063/1.354305Google Scholar
12. Levine, E. and Kitcher, J., in Proc. for the 220d International Reliability Physics Symposium, 242–249 (1984)..Google Scholar
13. Riege, S.P., Prybyla, J.A., and Hunt, A.W., Appl. Phys. Lett. 69 (16), p. 2367–2369 (1996).10.1063/1.117527Google Scholar
14. Mendenhall, W. and Sincich, T., in Statistics For Engineering and the Sciences, 4th ed. (Prentice-Hall, Inc., New Jersey, 1995), p. 460.Google Scholar
15. Kraft, O., Bader, S., Sanchez, J.E. Jr., and Artz, E., MRS Symp. Proc. 309, 199–204 (1993).10.1557/PROC-309-199Google Scholar
16. Marieb, T., Bravman, J., Flinn, P., and Madden, M., MRS Symp. Proc. 338, 409–413 (1994).10.1557/PROC-338-409Google Scholar
17. Lee, Bravman, J., Flinn, P., and Marieb, T. in Stress Induced Phenomena in Metallization: Fourth International Workshop, AlP Conference Proc. 418, 277–282 (1997).Google Scholar