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Effects of Aspect Ratio of Micro-sized Photoresist Patterns on Bond Strength between a Si Substrate with AFM Fracture Observation

Published online by Cambridge University Press:  01 February 2011

Chiemi Ishiyama ,
Akinobu Shibata ,
Masato Sone  and
Yakichi Higo
Chiemi Ishiyama
Affiliation:
[email protected], United States
Akinobu Shibata
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Laboratory, Yokohama, Japan
Masato Sone
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Laboratory, Yokohama, Japan
Yakichi Higo
Affiliation:
[email protected], Tokyo Inatitute of Technology, Precision and Intelligence Laboratory, Yokohama, Japan
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Abstract

Bond strength between three dimensional micro-sized cylindrical patterns and Si substrate has been evaluated to clarify the effects of the cylinder length vs. diameter ratio, i.e. the aspect ratio, on the bond strength. Cylindrical shape was employed for avoiding ambiguity of loading point under bend conditions. Multiple cylindrical specimens of an epoxy type photoresist, SU-8 with various lengths were fabricated on a silicon substrate under the same photolithographic condition. Bond strength between micro-sized SU-8 and Si substrate under bend loading mode was measured by a mechanical testing machine for micro-sized materials. The maximum bend moment is 9.6 × 10−6 Nm in average and lineally increases with increasing the aspect ratio. On the other hand, the maximum load, i.e. maximum shear load is 106 mN in average and almost constant with increasing aspect ratio. This result suggests that the shear stress near the interface may cause the initiation of delamination. This phenomenon is discussed with three dimensional fracture observation and quantitative analysis of the line profile around the initiation site by AFM.

Keywords

microelectro-mechanical (MEMS)adhesionfracture
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG03-09
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

1. Ishiyama, C., Sone, M. and Higo, Y., Key Engineering Materials, 345–346, 1185–1188 (2007)Google Scholar
2. Ishiyama, C., Shibata, A., Sone, M. and Higo, Y., MRS symposium proceedings, 1052, 217–222 (2007)Google Scholar
3. Takashima, K., Higo, Y., Sugiura, S., Shimojo, M., Mater.Trans. 42, 68 (2001)Google Scholar