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Effect of Substrate Materials on Mechanical Properties and Microstructure of Carbon Nitride Films Prepared by Ion-beam-assisted deposition

Published online by Cambridge University Press:  17 March 2011

Hidenobu Ohta ,
Akihito Matsumuro  and
Yutaka Takahashi
Hidenobu Ohta
Affiliation:
Nagoya University, Department of Microsystem Engineering, Nagoya, Aichi, 4648603, Japan
Akihito Matsumuro
Affiliation:
Nagoya University, Department of Microsystem Engineering, Nagoya, Aichi, 4648603, Japan
Yutaka Takahashi
Affiliation:
Mie University, Department of Mechanical Engineering, Tsu, Mie, 5148507, Japan
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Abstract

Carbon nitride (C-N) thin films were prepared on several substrates by ion-beam-assisted deposition technique. In this experiment, carbon was evaporated by electron beam. Nitrogen and argon ion beams were bombarded simultaneously. Aluminum alloy (7075), high-carbon chrome bearing steel (SUJ2), pure titanium plates (99.5%) and Si(100) wafer were used as substrates. Here, mechanical properties, such as hardness, adhesion, friction coefficient and wear resistance were investigated. These results show the adhesion between the films and substrates were improved by formation of the carbon layer. The microstructure of the carbon nitride films were investigated by cross sectional high-resolution transmission electron microscopy (HRTEM).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 647: Symposium O – Ion Beam Synthesis & Processing of Advanced Materials , 2000 , O11.8
Copyright
Copyright © Materials Research Society 2001

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References

1. Liu, A. Y. and Cohen, M. L., Science 254, 841 (1989).Google Scholar
2. Murzin, I. M., Tompa, G. S. and Forsyth, E. W., J. Vac. Sci. Technol. A15, 1336–1339 (1997).Google Scholar
3. Wei, J., Hing, P. and Mo, Z. Q., Wear 225–229, 1141–1147 (1999).Google Scholar
4. Ogata, K., Chubachi, J. F. D. and Fujimoto, F., J. Appl. Phys. 76, 3791 (1994).Google Scholar
5. Rossi, F., Andre, B., Veen, A. van, Mijnarends, P. E., Schut, H., Labohm, F., Dunlop, H., Delplancke, M. P. and Hubbard, K., J. Mater. Resr. 9, 2440 (1994).Google Scholar
6. Ren, Z. -M., Du, Y. -C., Qui, Y., Wu, J. -D., Ying, Z. -F., Xiong, X. -X. and Li, F. -M., Phys. Rev. B49, 51 (1995).Google Scholar
7. Wang, D. F., Kato, K. and Umehara, N., Surf. Coat. Technol. 123, 177–184 (2000).Google Scholar
8. Precht, W., Pancielejko, M. and Czyzniewski, A., Vacuum 53, 109–112 (1999).Google Scholar
9. Zou, X. R., Xie, J. Q. and Feng, J. Y., Surf. Coat. Technol. A15, 1336–1339 (1997).Google Scholar
10. Lee, D. Y., Kim, Y. H., Kim, I. K. and Baik, H. K., Thin Solid Films 355–356, 239–245 (1999).Google Scholar
11. Kohzaki, M., Matsumuro, A., Hayashi, T. and Muramatsu, M., Thin Solid Films 308–309, 239–244 (1997).Google Scholar
12. Ohta, H., Matsumuro, A., Uetani, M., Kato, Y., Takagi, M., Iwata, H. and Imura, T., Transaction of Materials Research Society of Japan 25[1], 325–328 (2000).Google Scholar
13. Hayashi, T., Matsumuro, A., Takahashi, Y. and Yamaguchi, K., Jpn. J. Appl. Phys. 38, 395 (1999).Google Scholar