Published online by Cambridge University Press: 26 February 2011
An integrated a-Si:H p-i-n thin film diode (TFD) substrate having an ring structure has been developed for driving active matrix liquid crystal display (LCD) panels. The TFD sub-trate developed is for a 5.5″ LCD panel with 115,200 (240×480) pixels. A series of technical data on the fabrication process and the electrical properties of the a-Si TFD are presented. It has been shown that the forward bias characteristics of TFD were mainly dominated by the carrier recombination in the i layer near the p/i interface, and control of the plasma etching condition for the a-Si TFD patterning was very important to reduce the leak current and to improve the production yield.