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Analysis of the Effects of Interior Aperture Angle on Print Quality in Solder Paste Stenciling

Published online by Cambridge University Press:  21 February 2011

K. Monaghan ,
L. Head ,
C. Sahay  and
J. Constable
K. Monaghan
Affiliation:
State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Binghamton, NY, 13902-6000
L. Head
Affiliation:
State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Binghamton, NY, 13902-6000
C. Sahay
Affiliation:
State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Binghamton, NY, 13902-6000
J. Constable
Affiliation:
State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Binghamton, NY, 13902-6000
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Abstract

Stencil apertures of various interior angle, i.e. angle between two sides of a polygon, are analyzed for print performance. Aperture size and sidewall taper are also examined for their individual and combined effects on printing. The results show no effect of interior angle within the bounds of the experiment. Sidewall taper becomes relevant when aperture geometry is nearly square.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 213
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1 Lau, John H., editor, Handbook of Fine Pitch Surface Mount Technology.Google Scholar
2 Ogata, S., “Rheology and Printibility of Solder Paste,” IEICE Transactions, August 1991.Google Scholar
3 Kasturi, S., “Fine-Pitch Printing: A Manufacturing Perspective,” Proceedings of Nepcon West '92.Google Scholar
4 Lapasin, R., “Rheological Characterization of Solder Pastes,” JEM, Vol.23, No. 6, 1994.Google Scholar
5 Missele, C., “Subtleties of Stencil Printing Solder,” SMT, April 1993.Google Scholar
6 Slezak, E., “Applying Kester Solderpaste To Surface Mount Assemblies.” Kester literature, Des Plaines, Illinois.Google Scholar
7 Curtin, M., “Squeegee Design Affects Solder Paste Deposition,” EP&P, June, 1992.Google Scholar
8 Adniance, J., (private communication).Google Scholar
9 Hutchins, C., “Stencil Technology: An Evolution,” SMT, March 1994.Google Scholar
10 Swanson, D., “The Stencil-The First Step in High Yield Assembly,” EP&P, July 1994.Google Scholar
11 Marks, G.T. et al. , “The Electroformed Stencil: A Solution to Printing Solder Paste for Fine Pitch Devices,” AMTX, Inc, International Society of Hybrid Manufacturers, product literature.Google Scholar
12 Kibbler, K., Master's Thesis, Binghamton University, 1994.Google Scholar