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Temperature-stable NdFeB micromagnets with high-energy densitycompatible with CMOS back end of line technology

Published online by Cambridge University Press:  21 December 2015

Tim Reimer
Affiliation:
Fraunhofer Institute for Silicon Technology, Fraunhoferstraße 1, 25524 Itzehoe, Germany Institute for Electrical Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
Fabian Lofink*
Affiliation:
Fraunhofer Institute for Silicon Technology, Fraunhoferstraße 1, 25524 Itzehoe, Germany
Thomas Lisec
Affiliation:
Fraunhofer Institute for Silicon Technology, Fraunhoferstraße 1, 25524 Itzehoe, Germany
Claas Thede
Affiliation:
Institute for Materials Science, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
Steffen Chemnitz
Affiliation:
Fraunhofer Institute for Silicon Technology, Fraunhoferstraße 1, 25524 Itzehoe, Germany Institute for Electrical Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
Bernhard Wagner
Affiliation:
Fraunhofer Institute for Silicon Technology, Fraunhoferstraße 1, 25524 Itzehoe, Germany Institute for Electrical Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
*
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Abstract

The performance of a novel type of NdFeB micromagnets fabricated by agglomerationof magnetic powder by atomic layer deposition is investigated. The ALD-bondedmicromagnets can withstand standard BEOL (back-end of line) processing and heattreatments at temperatures of up to 400 °C in air and vacuum withoutany significant impact on the demagnetization curves. By optimized packingdensity a remanence of 660 mT is realized for the micromagnets. The coercivityµ0Hc = 890 mT remains constant forall samples and corresponds to the powder value.

A comparison of the demagnetizing behavior of micromagnets with theory of solidbody magnets prove that the influence of particle shape and hollow spaces ondemagnetizing field is low. Hence, a similar impact of shape on stray field andforces as for solid body magnets can be assumed when integrating NdFeBALD-bonded micromagnets in applications.

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Articles
Copyright
Copyright © Materials Research Society 2015 

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References

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