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Ultra-thin TEM Sample Preparation with Advanced Backside FIB Milling Method

Published online by Cambridge University Press:  01 August 2010

H-J Kang
Affiliation:
Hynix Semiconductor Inc, Korea
JH Kim
Affiliation:
Hynix Semiconductor Inc, Korea
JW Oh
Affiliation:
Hynix Semiconductor Inc, Korea
TS Back
Affiliation:
Hynix Semiconductor Inc, Korea
HJ Kim
Affiliation:
Hynix Semiconductor Inc, Korea

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.

Type
Abstract
Copyright
Copyright © Microscopy Society of America 2010