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Ultrafine-Grained Microstructures of Al–Cu Alloys with Hypoeutectic and Hypereutectic Composition Produced by Extrusion Combined with Reversible Torsion
Published online by Cambridge University Press: 20 April 2022
Abstract
In this study, binary as-cast Al–Cu alloys: Al25Cu (Al–25%Cu) and Al45Cu (Al–45%Cu) (in wt%) were severely plastically deformed by extrusion combined with a reversible torsion (KoBo) method to produce an ultrafine-grained structure (UFG). The binary Al–Cu alloys consist of α-Al and intermetallic Al2Cu phases. The morphology and volume fraction of α-Al and Al2Cu phases depend on the Cu content. The KoBo process was carried out using extrusion ratios of λ = 30 and λ = 98. The effect of phase refinement has been studied by means of scanning electron microscopy with electron backscattering diffraction and scanning transmission electron microscopy. The mechanical properties were assessed using compression tests. Detailed microstructural analysis shows that after the KoBo process, a large number fraction of high-angle boundaries (HABs) and a very fine grain structure (~2–4 μm) in both phases are created. An increase of λ ratio during the KoBo processing leads to a decrease in average grain size of α-Al and Al2Cu phases and an increase in fraction of HABs. UFG microstructure and high fraction of HABs provide the grain boundary sliding mechanism during KoBo deformation. UFG microstructure contributes to the enhanced mechanical properties. Compressive strength (Rc) of Al25Cu alloy increases from 172 to 340 MPa with an increase of λ. Compressive strain (Sc) for Al25Cu alloy increased from 35 to 67% with an increase of λ. High fraction of intermetallic phase in Al45Cu alloy was responsible for room temperature strengthening of alloy and low compressive strain. The deformed Al45Cu alloy with λ = 30 showed that Rc is 194 MPa and Sc is equal to 10%.
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- The XVIIth International Conference on Electron Microscopy (EM2020)
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- Copyright © The Author(s), 2022. Published by Cambridge University Press on behalf of the Microscopy Society of America
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