Hostname: page-component-cd9895bd7-gbm5v Total loading time: 0 Render date: 2024-12-25T19:30:24.140Z Has data issue: false hasContentIssue false
  • English
  • Français

Three-Dimensional Reconstruction of Printed Circuit Boards: Comparative Study between 3D Femtosecond Laser Serial Sectioning and Optical Imaging versus 3D X-Ray Computed Tomography

Published online by Cambridge University Press:  22 July 2022

Nicholas May ,
Hongbin Choi ,
Adrian Phoulady ,
Pouya Tavousi  and
Sina Shahbazmohamadi
Nicholas May*
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
Hongbin Choi*
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
Adrian Phoulady
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
Pouya Tavousi
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States
Sina Shahbazmohamadi*
Affiliation:
REFINE Center, University of Connecticut, Storrs, CT, United States Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
*
*Corresponding author: [email protected]
*Corresponding author: [email protected]
*Corresponding author: [email protected]

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Advanced 3D Imaging and Analysis Methods for New Opportunities in Material Science
Information
Microscopy and Microanalysis , Volume 28 , Supplement S1 , August 2022 , pp. 284 - 286
Check for updates
Copyright
Copyright © Microscopy Society of America 2022

References

Quadir, Shahed E. et al. , ACM journal on emerging technologies in computing systems (JETC) 13, no. 1 (2016): 1-34.CrossRefGoogle Scholar
Asadizanjani, N et al. , “Non-destructive pcb reverse engineering using x-ray micro computed tomography.” In ISTFA 2015, pp. 164-172. ASM International, 2015.Google Scholar
Asadizanjani, Navid, Tehranipoor, Mark, and Forte, Domenic. “PCB reverse engineering using nondestructive X-ray tomography and advanced image processing.” IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 2 (2017): 292-299.Google Scholar
Hunt, J. A., Prasad, P., and Raz, E.. “Automated Serial-Section Polishing Tomography.” In ISTFA 2008, pp. 21-24. ASM International, 2008.Google Scholar
The authors have contributed equally to the manuscript.Google Scholar