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Three Dimensional Characterization of a Specific Site by an FIB Micro-Sampling Technique

Published online by Cambridge University Press:  02 July 2020

T. Yaguchi
Affiliation:
Hitachi Science Systems, Ltd., 882 Ichige, Hitachinaka, Ibaraki, 312-8504, Japan
Y. Kuroda
Affiliation:
Hitachi Science Systems, Ltd., 882 Ichige, Hitachinaka, Ibaraki, 312-8504, Japan
Y. Ueki
Affiliation:
Hitachi Science Systems, Ltd., 882 Ichige, Hitachinaka, Ibaraki, 312-8504, Japan
T. Kamino
Affiliation:
Hitachi Science Systems, Ltd., 882 Ichige, Hitachinaka, Ibaraki, 312-8504, Japan
T. Ohnishi
Affiliation:
Instrument Division, Hitachi Ltd., 882 Ichige, Hitachinaka, Ibaraki, 312-8504, Japan
K. Umemura
Affiliation:
Central Research Laboratory, Hitachi Ltd., Kokubunji, Tokyo , 185-8601, Japan
K. Asayama
Affiliation:
Semiconductor and Integrated Circuits Division, Hitachi Ltd., Oume, Tokyo, 198-8512, Japan
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Abstract

We have developed an FIB micro-sampling technique to prepare both plan view and cross-sectional TEM specimens from a specific site.

The instruments that were used in this study are the Hitachi FB-2000A FIB system equipped a with micromanipulator unit and an HF-2200 cold field emission 200kV analytical TEM equipped with a scanning attachment allowing both STEM and SEM imaging.

Figure 1 shows a procedure to prepare a micro-sample for either plan view or cross-sectional TEM observation of the specific site. First, the micro-sample for plan view TEM observation is trench milled by using an FIB(Figure 1a). Second, a tip of a micromanipulator W-probe is bonded to the micro-sample with the FIB assisted metal deposition. Then, the micro-sample is lifted out and transferred onto a micro-sample carrier(Figure 1b).

Type
Applications and Developments of Focused Ion Beam (FIB) Instruments (Organized by L. Giannuzzi)
Copyright
Copyright © Microscopy Society of America 2001

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References

1. Kamino, T., et al., Proc. Microsc. and Microanal. 6, Suppl2 (2000) 510511CrossRefGoogle Scholar

2. Ohnishi, T.,et al., Proc.25thInt.Symp. for Testing and Failure Analysis (1999) 449503Google Scholar