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TEM Sample Preparation for the Semiconductor Industry using the Allied High Tech Multiprep™ Polishing System in Conjunction with the Gat an Broad Beam Gun™ and Graphite Holder and Accessories
Published online by Cambridge University Press: 02 July 2020
Extract
Due to the decreasing size of components in the semiconductor industry, TEM sample preparation grows increasingly difficult. And at the same time the customer need for TEM analysis increases, along with the urgency to report the data. We have found that TEM sample preparation has been greatly improved using the combination of the Allied High Tech MultiPrep™ System (Figure 1) in conjunction with the Gatan Broad Beam Guns™ with the Graphite Holder and accessories. The technique discussed in this paper will show that this procedure for sample preparation has decreased the time it takes to prepare the sample, decreased the number of failing samples and increased the ability to do high resolution imaging.
The MultiPrep™ is used when repeatability is critical for sample preparation and eliminates the function of holding the polisher by hand. When polishing by hand the amount of force placed on the sample while polishing is inconsistent.
- Type
- Specimen Preparation Techniques for Materials Sciences
- Information
- Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 492 - 493
- Copyright
- Copyright © Microscopy Society of America
References
1 Allied High Tech Micro Positioning Head Operating Instructions and Procedures ManualGoogle Scholar