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TEM Sample Preparation for the Semiconductor Industry using the Allied High Tech Multiprep™ Polishing System in Conjunction with the Gat an Broad Beam Gun™ and Graphite Holder and Accessories

Published online by Cambridge University Press:  02 July 2020

Leah L. Dobbs
Affiliation:
Chemical and Surface Analysis Division, Transmission Electron Microscopy Group, ON Semiconductor, Phoenix, Arizona, 85008, USA
Rebecca X. Ai
Affiliation:
Chemical and Surface Analysis Division, Transmission Electron Microscopy Group, ON Semiconductor, Phoenix, Arizona, 85008, USA
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Extract

Due to the decreasing size of components in the semiconductor industry, TEM sample preparation grows increasingly difficult. And at the same time the customer need for TEM analysis increases, along with the urgency to report the data. We have found that TEM sample preparation has been greatly improved using the combination of the Allied High Tech MultiPrep™ System (Figure 1) in conjunction with the Gatan Broad Beam Guns™ with the Graphite Holder and accessories. The technique discussed in this paper will show that this procedure for sample preparation has decreased the time it takes to prepare the sample, decreased the number of failing samples and increased the ability to do high resolution imaging.

The MultiPrep™ is used when repeatability is critical for sample preparation and eliminates the function of holding the polisher by hand. When polishing by hand the amount of force placed on the sample while polishing is inconsistent.

Type
Specimen Preparation Techniques for Materials Sciences
Copyright
Copyright © Microscopy Society of America

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References

1 Allied High Tech Micro Positioning Head Operating Instructions and Procedures ManualGoogle Scholar