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TEM and HRTEM Characterization of TiAl Diffusion Bonds Using Ni/Al Nanolayers

Published online by Cambridge University Press:  29 August 2014

Sónia Simões Open the ORCID record for Sónia Simões [Opens in a new window] ,
Filomena Viana ,
Ana S. Ramos ,
Maria T. Vieira  and
Manuel F. Vieira
Sónia Simões*
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
Filomena Viana
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
Ana S. Ramos
Affiliation:
CEMUC, Department of Mechanical Engineering, University of Coimbra, R. Luís Reis Santos, 3030-788 Coimbra, Portugal
Maria T. Vieira
Affiliation:
CEMUC, Department of Mechanical Engineering, University of Coimbra, R. Luís Reis Santos, 3030-788 Coimbra, Portugal
Manuel F. Vieira
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
*
*Corresponding author. [email protected]
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Abstract

Diffusion bonding of TiAl alloys can be enhanced by the use of reactive nanolayer thin films as interlayers. Using these interlayers, it is possible to reduce the conventional bonding conditions (temperature, time, and pressure) and obtain sound and reliable joints. The microstructural characterization of the diffusion bond interfaces is a fundamental step toward understanding and identifying the bonding mechanisms and relating them to the strength of the joints. The interface of TiAl samples joined using Ni/Al nanolayers was characterized by transmission electron microscopy and scanning transmission electron microscopy. Microstructural characterization of the bond revealed that the interfaces consist of several thin layers of different composition and grain size (nanometric and micrometric). The bonding temperature (800, 900, or 1,000°C) determines the grain size and thickness of the layers present at the interface. Phase identification by high-resolution transmission electron microscopy combined with fast Fourier transform and electron energy-loss spectroscopy analyses reveals the presence of several intermetallic compounds: AlTiNi, NiAl, and Al2TiNi. For bonds produced at 800 and 900°C, nanometric grains of Ti were detected at the center of the interface.

Keywords

electron microscopydiffusion bondingmultilayer thin filmselectron energy-loss spectroscopyenergy-dispersive X-ray spectroscopy
Type
SPMicros Special Section
Information
Microscopy and Microanalysis , Volume 21 , Issue 1 , February 2015 , pp. 132 - 139
Copyright
© Microscopy Society of America 2014 

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