Strain Measurements at a NiSi/Si Interface Using STEM-CBED: A Quantifaction Method for Stress Relaxation During TEM Lamella Preparation

R. Pantel; L. Clément; J. L. Rouvière; L.F.Tz. Kwakman

doi:10.1017/S1431927603444334

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Benedetti, A. Bender, H. Torregiani, C. Dal, M. Van and Maex, K. 2004. Nanometer scale characterisation of CoSi2 and NiSi induced strain in Si by convergent beam electron diffraction. Materials Science and Engineering: B, Vol. 114-115, Issue. , p. 61.

Chuvilin, A. and Kaiser, U. 2005. On the peculiarities of CBED pattern formation revealed by multislice simulation. Ultramicroscopy, Vol. 104, Issue. 1, p. 73.

Kaiser, Ute and Chuvilin, Andrey 2006. Prospects of the multislice method for CBED pattern calculation. International Journal of Materials Research, Vol. 97, Issue. 7, p. 912.

Alfonso, C. Alexandre, L. Leroux, Ch. Jurczak, G. Saikaly, W. Charaï, A. and Thibault-Penisson, J. 2010. HOLZ lines splitting on SiGe/Si relaxed samples: Analytical solutions for the kinematical equation. Ultramicroscopy, Vol. 110, Issue. 4, p. 285.

Su, Dong 2014. Transmission Electron Microscopy Characterization of Nanomaterials. p. 577.

Wang, BinBin Esser, Bryan D. Bagués, Nuria Yan, Jiaqiang Blumer, Ari N. and McComb, David W. 2019. The Effect of Nonuniform Pixel Responses in CCD on Quantitative Analysis. Microscopy and Microanalysis, Vol. 25, Issue. S2, p. 230.

Pofelski, A. Whabi, V. Ghanad-Tavakoli, S. and Botton, G. 2021. Assessment of the strain depth sensitivity of Moiré sampling Scanning Transmission Electron Microscopy Geometrical Phase Analysis through a comparison with Dark-Field Electron Holography. Ultramicroscopy, Vol. 223, Issue. , p. 113225.

Kaiser, Ute and Chuvilin, Andrey 2022. Prospects of the multislice method for CBED pattern calculation. International Journal of Materials Research, Vol. 97, Issue. 7, p. 912.

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Strain Measurements at a NiSi/Si Interface Using STEM-CBED: A Quantifaction Method for Stress Relaxation During TEM Lamella Preparation

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