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A Straightforward Method for Measuring the Elastic and Inelastic Mean Free Paths for Scattering of Fast Electrons in Technologically Important Thin-Film Oxides

Published online by Cambridge University Press:  22 July 2022

Adham Basha ,
George Levi ,
Tamir Amrani ,
Yang Li ,
Guy Ankonina ,
Pini Shekhter ,
Lior Kornblum ,
Ilan Goldfarb  and
Amit Kohn
Adham Basha
Affiliation:
Department of Materials Science and Engineering, The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, Ramat Aviv, Tel Aviv, Israel
George Levi
Affiliation:
Department of Materials Science and Engineering, The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, Ramat Aviv, Tel Aviv, Israel
Tamir Amrani
Affiliation:
Department of Materials Science and Engineering, The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, Ramat Aviv, Tel Aviv, Israel
Yang Li
Affiliation:
Andrew and Erna Viterbi Faculty of Electrical and Computer Engineering, Technion – Israel Institute of Technology, Haifa, Israel
Guy Ankonina
Affiliation:
Andrew and Erna Viterbi Faculty of Electrical and Computer Engineering, Technion – Israel Institute of Technology, Haifa, Israel
Pini Shekhter
Affiliation:
Tel Aviv University Center for Nanoscience and Nanotechnology, Tel Aviv University, Ramat Aviv, Tel Aviv, Israel
Lior Kornblum
Affiliation:
Andrew and Erna Viterbi Faculty of Electrical and Computer Engineering, Technion – Israel Institute of Technology, Haifa, Israel
Ilan Goldfarb
Affiliation:
Department of Materials Science and Engineering, The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, Ramat Aviv, Tel Aviv, Israel
Amit Kohn*
Affiliation:
Department of Materials Science and Engineering, The Iby and Aladar Fleischman Faculty of Engineering, Tel Aviv University, Ramat Aviv, Tel Aviv, Israel
*
*Corresponding author: [email protected]

Abstract

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Type
Science of Metrology with Electrons
Information
Microscopy and Microanalysis , Volume 28 , Supplement S1 , August 2022 , pp. 774 - 778
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Copyright
Copyright © Microscopy Society of America 2022

References

Kimura, M. et al. , Sci. Rep., 11 (2021), p.580, doi:10.1038/s41598-020-79806-w.CrossRefGoogle Scholar
Lee, T.-J., Kim, S.-K., Seong, T.-Y., Sci. Rep., 10 (2020), p.5761, doi:10.1038/s41598-020-62642-3.CrossRefGoogle Scholar
Kirk, D. et al. , Phys. Rev. B - Condens. Matter Mater. Phys., 79 (2009), p.1, doi:10.1103/PhysRevB.79.014203.CrossRefGoogle Scholar
Bassiri, R. et al. , Appl. Phys. Lett., 98 (2011), p.3 doi:10.1063/1.3535982.CrossRefGoogle Scholar
Umeda, K. et al. , J. Phys. Conf. Ser., 1052 (2018), p.1, doi:10.1088/1742-6596/1052/1/012016.CrossRefGoogle Scholar
Kohn, A., Kovács, A., Uhrmann, T., Appl. Phys. Lett., 95 (2009), p.42506, doi:10.1063/1.3182732.CrossRefGoogle Scholar
Vizzini, S. et al. , J. Cryst. Growth, 305 (2007), p.26, doi:10.1016/J.JCRYSGRO.2007.03.037.CrossRefGoogle Scholar
Cockayne, D.J.H., Annu. Rev. Mater. Res., 37 (2007), p.159, doi:10.1146/annurev.matsci.35.082803.103337.CrossRefGoogle Scholar
Ganesh, K.J. et al. , Microsc. Microanal., 16 (2010), p.614, doi:10.1017/S1431927610000334.CrossRefGoogle Scholar
Oh-ishi, K., Ohsuna, T., Ultramicroscopy, 212 (2020), p.112955, doi:10.1016/j.ultramic.2020.112955.CrossRefGoogle Scholar
Lee, C.W., Ikematsu, Y., Shindo, D., J. Electron Microsc., 51 (2002), p.143, doi:10.1093/jmicro/51.3.143.CrossRefGoogle Scholar
Potapov, P.L., Ultramicroscopy, 147 (2014), p.21, doi:10.1016/j.ultramic.2014.05.010.CrossRefGoogle Scholar
Yang, Y.Y., Egerton, R.F., Micron, 26 (1995), p.1, doi:10.1016/0968-4328(94)00039-S.CrossRefGoogle Scholar
Malis, T., Cheng, S.C., Egerton, R.F., J. Electron Microsc. Tech., 8 (1988), p.193, doi:10.1002/jemt.1060080206.CrossRefGoogle Scholar
Berriman, J. et al. , Ultramicroscopy, 13 (1984), p.351, doi:10.1016/0304-3991(84)90001-9.CrossRefGoogle Scholar
Pan, Z., Davies, C.K.L., Stevens, R.N., J. Mater. Sci., 29 (1994), p.1920, doi:10.1007/BF00351314.CrossRefGoogle Scholar
Allen, S.M., Hall, E.L., Philos. Mag. A., 46 (1982), p.243, doi:10.1080/01418618208239917.CrossRefGoogle Scholar
Kelly, P.M., Jostsons, A., Blake, R.G., et al. , Phys. status solidi, 31 (1975), p.771, doi:10.1002/PSSA.2210310251.CrossRefGoogle Scholar
Mitchell, D.R.G., J. Microsc., 224 (2006), p.187, doi:10.1111/J.1365-2818.2006.01690.X.CrossRefGoogle Scholar
Schweiss, D.T., Hwang, J., Voyles, P.M., Ultramicroscopy, 124 (2013), p.6, doi:10.1016/j.ultramic.2012.08.005.CrossRefGoogle Scholar
Ghatak, J., Chatterjee, A., Shivaprasad, S.M., J. Microsc., 282 (2021), p.250, doi:10.1111/jmi.12999.CrossRefGoogle Scholar
Zhang, H.-R., Egerton, R.F., Malac, M., Micron, 43 (2012), 8, doi:10.1016/j.micron.2011.07.003.CrossRefGoogle Scholar
Meltzman, H. et al. , J. Microsc., 236 (2009), p.165, doi:10.1111/J.1365-2818.2009.03214.X.CrossRefGoogle Scholar
Cockayne, D. et al. , J. Phys. Conf. Ser., 241 (2010), doi:10.1088/1742-6596/241/1/012006.CrossRefGoogle Scholar
Liechty, G. D., Hirsch, E., and Smith, C. A., “MultiPrepTM Procedure TEM Wedge Preparation of an Integrated Circuit (IC),” 2003.Google Scholar
Egerton, R.F., Phys. Status Solidi, 37 (1976), p.663, doi:10.1002/pssa.2210370237.CrossRefGoogle Scholar
Iakoubovskii, K., Mitsuishi, K., Nakayama, Y., et al. , Microsc. Res. Tech., 71 (2008), p.626, doi:10.1002/jemt.20597.CrossRefGoogle Scholar
Lee, C. W., Ikematsu, Y., and Shindo, D., Materials Transactions JIM, 41 (2000), p.1129, doi: 10.2320/matertrans1989.41.1129.CrossRefGoogle Scholar
Zhang, P. et al. , Ultramicroscopy, 171 (2016), p.89, doi:10.1016/j.ultramic.2016.09.005.CrossRefGoogle Scholar
The authors acknowledge funding from the ISF-NSFC joint research program (grant No. 3373/19). Sample fabrication was done with the support of the Technion's Micro-Nano Fabrication and Printing Unit (MNF&PU).Google Scholar