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Silver Nanowire Diameter and Yield Characterization by High-Throughput SEM and Image Analysis

Published online by Cambridge University Press:  25 July 2016

Clifford S Todd ,
William A Heeschen ,
Peter Y Eastman  and
Ellen C Keene
Clifford S Todd
Affiliation:
Analytical Sciences, The Dow Chemical Company, Midland MI, USA.
William A Heeschen
Affiliation:
Analytical Sciences, The Dow Chemical Company, Midland MI, USA.
Peter Y Eastman
Affiliation:
Analytical Sciences, The Dow Chemical Company, Collegeville PA, USA.
Ellen C Keene
Affiliation:
Analytical Sciences, The Dow Chemical Company, Midland MI, USA.

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 22 , Supplement S3: Proceedings of Microscopy & Microanalysis 2016 , July 2016 , pp. 568 - 569
Copyright
© Microscopy Society of America 2016 

References

References:

[1] De, S, et al., ACS Nano 3 (2009). p. 1767.Google Scholar
[2] Lunn, J & Malek., A US Patent Application 20130283974 A1 2013.Google Scholar
[3] Athens, GL, et al, TechConnect World conference 2015.Google Scholar