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Silicon Oxynitride Film Thickness Measurements Using HRTEM and Grazing Incidence X-Ray Photoelectron Spectroscopy (GIXPS)

Published online by Cambridge University Press:  02 July 2020

John Henry J. Scott
Affiliation:
Surface and Microanalysis Science Division National Institute of Standards and Technology, Gaithersburg, MD20899-8371
Eric W. Landree
Affiliation:
Surface and Microanalysis Science Division National Institute of Standards and Technology, Gaithersburg, MD20899-8371
Terrence Jach
Affiliation:
Surface and Microanalysis Science Division National Institute of Standards and Technology, Gaithersburg, MD20899-8371
Eric S. Windsor
Affiliation:
Surface and Microanalysis Science Division National Institute of Standards and Technology, Gaithersburg, MD20899-8371
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Extract

The ability to accurately and precisely measure the thickness of ultrathin (∼ 3 nm) dielectric films, used as gate dielectrics in integrated circuits, is critical to the continued success of the semiconductor manufacturing industry. Many metrology tools have been applied to this problem in the past, but recent research has focussed on ellipsometry, x-ray reflectivity, secondary-ion mass spectrometry, capacitance-voltage curves, medium energy ion scattering, high resolution transmission electron microscopy (HRTEM), and grazing incidence x-ray photoelectron spectroscopy (GIXPS). Unfortunately, these techniques disagree about a given film's thickness by amounts larger than their individual precisions. To support the statistical process control methodologies used in production wafer fabrication, these disagreements need to be investigated and the true accuracy and precision of the tools need to be determined. This work compares the ability of two techniques, HRTEM and GIXPS, to measure the thickness of silicon oxynitride films on silicon substrates.

Type
Sir John Meurig Thomas Symposium: Microscopy and Microanalysis in the Chemical Sciences
Copyright
Copyright © Microscopy Society of America

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References

1.Roy, P.K., et al. in Materials Reliability in Microelectronics VII, MRS Proc. 473(1997)89.Google Scholar
2. Available from the National Center for Electron Microscopy (NCEM) at http://ncem.lbl.gov/frames/software.htmGoogle Scholar
3.Scott, J.H., Windsor, E.S.“Chemical and Structural Characterization of Ultrathin Dielectric Films using AEM” in Structure and Electronic Properties of Ultrathin Dielectric Films on Silicon and Related Structures, edited by Buchanan, D., et al., (Materials Research Society Proceedings, Pittsburgh, PA, 2000) (in press).Google Scholar
4.Jach, T., Gormley, J., Thurgate, S., Spectrochimica Acta 1354(1999)1539.CrossRefGoogle Scholar