Hostname: page-component-cd9895bd7-lnqnp Total loading time: 0 Render date: 2024-12-26T05:18:25.649Z Has data issue: false hasContentIssue false
  • English
  • Français

Selectively Electron-Transparent Microstamping Toward Concurrent Digital Image Correlation and High-Angular Resolution Electron Backscatter Diffraction (EBSD) Analysis

Published online by Cambridge University Press:  04 December 2017

Timothy J. Ruggles ,
Geoffrey F. Bomarito ,
Andrew H. Cannon  and
Jacob D. Hochhalter
Timothy J. Ruggles*
Affiliation:
National Institute of Aerospace, Hampton, VA, USA
Geoffrey F. Bomarito
Affiliation:
Langley Research Center, National Aeronautics and Space Administration, Hampton, VA, USA
Andrew H. Cannon
Affiliation:
1900 Engineering, LLC, Clemson, SC, USA Department of Chemical and Biomolecular Engineering, Clemson University, Clemson, SC, USA
Jacob D. Hochhalter
Affiliation:
Langley Research Center, National Aeronautics and Space Administration, Hampton, VA, USA
*
*Corresponding author. [email protected]
Get access

Abstract

Digital image correlation (DIC) in a scanning electron microscope and high-angular resolution electron backscatter diffraction (HREBSD) provide valuable and complementary data concerning local deformation at the microscale. However, standard surface preparation techniques are mutually exclusive, which makes combining these techniques in situ impossible. This paper introduces a new method of applying surface patterning for DIC, namely a urethane microstamp, that provides a pattern with enough contrast for DIC at low accelerating voltages, but is virtually transparent at the higher voltages necessary for HREBSD and conventional EBSD analysis. Furthermore, microstamping is inexpensive and repeatable, and is more suitable to the analysis of patterns from complex surface geometries and larger surface areas than other patterning techniques.

Keywords

high-angular resolution EBSDEBSDdigital image correlationlithographymicrostamping
Type
Materials Science Applications
Information
Microscopy and Microanalysis , Volume 23 , Issue 6 , December 2017 , pp. 1091 - 1095
Copyright
© Microscopy Society of America 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Alkorta, J. (2013). Limits of simulation based high resolution EBSD. Ultramicroscopy 131, 33–38.Google Scholar
Bomarito, G., Hochhalter, J., Ruggles, T. & Cannon, A. (2017). Increasing accuracy and precision of digital image correlation through pattern optimization. Optics Lasers Eng 91, 73–85.CrossRefGoogle Scholar
Book, T.A. & Sangid, M.D. (2016). Evaluation of select surface processing techniques for in situ application during the additive manufacturing build process. JOM 68, 1780–1792.CrossRefGoogle Scholar
Brigham Young University (2015–2016). OpenXY, github.com/BYU-MicrostructureOfMaterials/OpenXY.Google Scholar
Cannon, A., Maguire, M. & Hochhalter, J. (2015a). Method and stamp for repeatable image correlation micro patterning and resulting specimen produced therefrom. US Patent Application 62116742.Google Scholar
Cannon, A.H., Hochhalter, J.D., Bomarito, G.F. & Ruggles, T.J. (2016). Micro speckle stamping: High contrast, no basecoat, repeatable, well-adhered. Conference Proceedings of the Society for Experimental Mechanics Series, International Digital Imaging Correlation Society, Philadelphia.Google Scholar
Cannon, A.H., Hochhalter, J.D., Mello, A.W., Bomarito, G.F. & Sangid, M.D. (2015b). Microstamping for improved speckle patterns to enable digital image correlation. Microsc Microanal 21, 451–452.Google Scholar
Choi, Y.S., Groeber, M.A., Shade, P.A., Turner, T.J., Schuren, J.C., Dimiduk, D.M., Uchic, M.D. & Rollett, A.D. (2014). Crystal plasticity finite element method simulations for a polycrystalline Ni micro-specimen deformed in tension. Metall Mater Trans A 45, 6352–6359.Google Scholar
Correlated Solutions (2009). VIC-2D, Reference Manual. Available at http://www.correlatedsolutions.com (Retrieved January 17, 2017).Google Scholar
Di Gioacchino, F. & Quinta da Fonseca, J. (2013). Plastic strain mapping with sub-micron resolution using digital image correlation. Exp Mech 53, 743–754.CrossRefGoogle Scholar
Dingreville, R., Karnesky, R.A., Puel, G. & Schmitt, J.H. (2016). Review of the synergies between computational modeling and experimental characterization of materials across length scales. J Mater Sci 51, 1178–1203.CrossRefGoogle Scholar
Githens, A. & Daly, S. (2017). Patterning corrosion-susceptible metallic alloys for digital image correlation in a scanning electron microscope. Strain 53, e12215–n/a.CrossRefGoogle Scholar
Gupta, V.K., Willard, S.A., Hochhalter, J.D. & Smith, S.W. (2014). Microstructure-scale in-situ image correlation-based study of grain deformation and crack tip displacements in Al–Cu alloys. Mater Perf Character 4, 228–253.Google Scholar
Jiang, J., Zhang, T., Dunne, F.P.E. & Britton, T.B. (2016). Deformation compatibility in a single crystalline Ni superalloy. Proc R Soc A Math Phys Eng Sci 472, 1–24.Google Scholar
Kammers, A.D. & Daly, S. (2011). Small-scale patterning methods for digital image correlation under scanning electron microscopy. Measur Sci Technol 22, 125501.CrossRefGoogle Scholar
Lecompte, D., Smits, A., Bossuyt, S., Sol, H., Vantomme, J., Hemelrijck, D.V. & Habraken, A. (2006). Quality assessment of speckle patterns for digital image correlation. Opt Lasers Eng 44, 1132–1145.Google Scholar
Lim, H., Carroll, J.D., Battaile, C.C., Boyce, B.L. & Weinberger, C.R. (2015). Quantitative comparison between experimental measurements and CP-FEM predictions of plastic deformation in a tantalum oligocrystal. Int J Mech Sci 92, 98–108.CrossRefGoogle Scholar
Lim, H., Subedi, S., Fullwood, D., Adams, B. & Wagoner, R. (2014). A practical meso-scale polycrystal model to predict dislocation densities and the Hall-Petch effect. Mater Trans 55, 35–38.Google Scholar
Mello, A.W., Nicolas, A., Lebensohn, R.A. & Sangid, M.D. (2016). Effect of microstructure on strain localization in a 7050 aluminum alloy: comparison of experiments and modeling for various textures. Mater Sci Eng A 661, 187–197.Google Scholar
Odom, T.W., Thalladi, V.R., Love, J.C. & Whitesides, G.M. (2002). Generation of 30–50 nm structures using easily fabricated, composite PDMS masks. J Am Chem Soc 124, 12112–12113.Google Scholar
Ruggles, T., Cluff, S., Miles, M., Fullwood, D., Daniels, C., Avila, A. & Chen, M. (2016a). Ductility of advanced high-strength steel in the presence of a sheared edge. JOM 68, 1839–1849.Google Scholar
Ruggles, T., Fullwood, D. & Kysar, J. (2016b). Resolving geometrically necessary dislocation density onto individual dislocation types using EBSD-based continuum dislocation microscopy. Int J Plasticity 76, 231–243.Google Scholar
Wilkinson, A.J., Meaden, G. & Dingley, D.J. (2006). High resolution mapping of strains and rotations using electron back scatter diffraction. Mater Sci Technol 22, 1–11.Google Scholar
Yan, D., Tasan, C.C. & Raabe, D. (2015). High resolution in situ mapping of microstrain and microstructure evolution reveals damage resistance criteria in dual phase steels. Acta Mater 96, 399–409.CrossRefGoogle Scholar
Zhang, T., Collins, D.M., Dunne, F.P. & Shollock, B.A. (2014). Crystal plasticity and high-resolution electron backscatter diffraction analysis of full-field polycrystal Ni superalloy strains and rotations under thermal loading. Acta Mater 80, 25–38.Google Scholar