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Precision TEM Specimen Preparation for Integrated Circuits using Dual-Beam FIB Lift-Out Technique

Published online by Cambridge University Press:  02 July 2020

Youren Xu ,
Chris Schwappach  and
Ron Cervantes
Youren Xu
Affiliation:
Intel Corporation, New Mexico Materials Lab, 4100 Sara Road, Rio Rancho, NM, 87124
Chris Schwappach
Affiliation:
Intel Corporation, New Mexico Materials Lab, 4100 Sara Road, Rio Rancho, NM, 87124
Ron Cervantes
Affiliation:
Intel Corporation, New Mexico Materials Lab, 4100 Sara Road, Rio Rancho, NM, 87124
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Focused ion beam lift-out technique has become increasingly attractive to the TEM community due to its unique advantage of no mechanical grinding/polishing involved in the process [1-3]. The technique essentially consists of two parts: preparation of membrane using focused ion beam (FIB) and transfer of the membrane (lift-out) to a grid. Up to date, this technique has only been demonstrated on single beam FIB systems. From a practical standpoint, overall sample quality (thickness) and lack of end-point precision are two major issues associated with the conventional single beam FIB technique. These issues are primarily related to ion beam damage and endpoint control encountered during the final stages of specimen thinning. As a result, the widespread use of FIB lift-out technique for high precision TEM specimen preparation has been limited. Recent technological advances have made it possible to combine both an electron beam column and an ion beam column into an integrated dual beam-focused ion beam (DB-FIB) system.

Type
Applications and Developments of Focused Ion Beams
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 516 - 517
Copyright
Copyright © Microscopy Society of America

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References

References:

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