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Open-hardware, High-vacuum Storage for TEM Holders Remedies and Quantifies Hydrocarbon Contamination

Published online by Cambridge University Press:  30 July 2020

Yin Min Goh ,
Jonathan Schwartz ,
Tao Ma ,
Bobby Kerns  and
Robert Hovden
Yin Min Goh
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Jonathan Schwartz
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Tao Ma
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Bobby Kerns
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Robert Hovden
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States

Abstract

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Type
Pushing the Limits of Detection in Quantitative (S)TEM Imaging, EELS, and EDX
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 3120 - 3123
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Copyright
Copyright © Microscopy Society of America 2020

References

Love, G., et al. ., Scanning 4 , 32–39 (1981).10.1002/sca.4950040105CrossRefGoogle Scholar
Stewart, R.L., Phys. Rev. 45, 488–490 (1934).10.1103/PhysRev.45.488CrossRefGoogle Scholar
Conru, H.W., Laberge, P.C., J. Phys. E: Sci. Instrum. 8 (1975).10.1088/0022-3735/8/2/021CrossRefGoogle Scholar
Hillier, J., Journal of Applied Physics 19, 226–230 (1948).10.1063/1.1715049CrossRefGoogle Scholar
de Jonge, N., et al. ., Nature Review Materials 14 (2019).Google Scholar
Soong, C., et al. ., Microscopy Today 20, 44–48 (2012).10.1017/S1551929512000752CrossRefGoogle Scholar
Griffiths, A.J.V., Walther, T., J. Phys.: Conf. Ser. 241 012017 (2010).Google Scholar
Leuthner, G.T., et al. ., Ultramicroscopy 203, 76–81 (2019).10.1016/j.ultramic.2019.02.002CrossRefGoogle Scholar
Bance, U.R., et al. ., Vacuum. 28 (1978).10.1016/S0042-207X(78)80029-3CrossRefGoogle Scholar
Conru, H.W., Laberge, P.C., J. Phys. E: Sci. Instrum. 8 (1975).10.1088/0022-3735/8/2/021CrossRefGoogle Scholar
Ennos, A.E., Journal of Applied Physics. 4, 101–106 (1953).Google Scholar
Williams, D.B., Carter, C.B., Transmission Electron Microscopy: A Textbook for Materials Science, Springer-Verlag (2009).10.1007/978-0-387-76501-3CrossRefGoogle Scholar
Jousten, K., Proceedings of Vacuum Technology, CERN Accelerator School (1999).Google Scholar
Jousten, K., Vacuum 49 359–360 (1998).10.1016/S0042-207X(98)00002-5CrossRefGoogle Scholar
Grinham, R., Chew, A., Appl. Sci. Converg. Technol. 26, 95–109 (2017).10.5757/ASCT.2017.26.5.95CrossRefGoogle Scholar
Hettler, S., et al. ., Micron. 96, 38–47 (2017).10.1016/j.micron.2017.02.002CrossRefGoogle Scholar
Dayton, B., Trans. 8th AVS. VAC. Symp. 42 (1961).Google Scholar
McGilvery, C.M., et al. ., Micron. 43, 450–455 (2012).10.1016/j.micron.2011.10.026CrossRefGoogle Scholar
Griffiths, A.J.V., Walther, T., J. Phys.: Conf. Ser. 241, 012017 (2010).Google Scholar
Acknowledgements: Authors recognize support from the Michigan Center for Materials Characterization (MC2) and inspiration from other facilities with custom, in-house TEM manifolds—including Cornell University and McMaster University.Google Scholar