Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-24T18:38:45.194Z Has data issue: false hasContentIssue false

Novel Workflow for Improved Throughput, Turnaround Time, and Cross Section Preparation of Microelectronic Devices

Published online by Cambridge University Press:  30 July 2020

William Podrazky
Affiliation:
Hitachi High Technologies America, Inc, Clarksburg, Maryland, United States
Jamil Clarke
Affiliation:
Hitachi High Technologies America, Inc, Clarksburg, Maryland, United States
Takeshi Sunaoshi
Affiliation:
Hitachi High Technologies America, Inc, Clarksburg, Maryland, United States
Akinari Morikawa
Affiliation:
Hitachi High Tech Corporation, Hitachinaka, Ibaraki, Japan
Chihiro Nomaguchi
Affiliation:
Hitachi High Tech Corporation, Hitachinaka, Ibaraki, Japan
Atsushi Muto
Affiliation:
Hitachi High Technologies America, Inc, Clarksburg, Maryland, United States

Abstract

Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Vendor Symposium
Copyright
Copyright © Microscopy Society of America 2020

References

Goldstein, J. et al. , “Scanning Electron Microscopy and X-ray Microanalysis”, (2003) p.p. 537555Google Scholar