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Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

Published online by Cambridge University Press:  23 November 2012

N. Shishido ,
H. Sugiyama ,
S. Kamiya ,
M. Omiya ,
T. Nagasawa ,
T. Nokuo ,
T. Suzuki  and
T. Nakamura
N. Shishido
Affiliation:
Nagoya Institute of Technology, Nagoya, Japan
H. Sugiyama
Affiliation:
Nagoya Institute of Technology, Nagoya, Japan
S. Kamiya
Affiliation:
Nagoya Institute of Technology, Nagoya, Japan
M. Omiya
Affiliation:
Keio University, Yokohama, Japan
T. Nagasawa
Affiliation:
JEOL Ltd., Akishima, Japan
T. Nokuo
Affiliation:
JEOL Ltd., Akishima, Japan
T. Suzuki
Affiliation:
Fujitsu Laboratories Ltd., Atsugi, Japan
T. Nakamura
Affiliation:
Fujitsu Laboratories Ltd., Atsugi, Japan
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Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.

Type
Research Article
Information
Microscopy and Microanalysis , Volume 18 , Issue S2: Proceedings of Microscopy & Microanalysis 2012 , July 2012 , pp. 766 - 767
Copyright
Copyright © Microscopy Society of America 2012

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