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Microstructural Evolution in Al-Ti Multilayered Film with Annealing

Published online by Cambridge University Press:  02 July 2020

R. Mitra
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, IL60208.
W.A. Chiou
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, IL60208.
A.Madan
Affiliation:
Advanced Coating Technology Group, Northwestern University, Evanston, IL60208.
R. Hoffman
Affiliation:
Advanced Coating Technology Group, Northwestern University, Evanston, IL60208.
J.R. Weertman
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, IL60208.
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Extract

There has been a significant interest in the development of dispersion-hardened aluminum for many years for high specific strength and modulus. Such materials are usually processed by powder or ingot metallurgy routes. In this study, Al3 Ti dispersion hardened Al was obtained by annealing Al-Ti multilayers. Al-Ti multilayered films have been characterized in the past by observing the structure of the layers, as well as tensile properties and hardness. This paper reports the structure of Al-Ti multilayers and the evolution of matrix and dispersoid microstructure on annealing.

The Al-Ti multilayered structures were prepared by magnetron sputtering using Al and Ti as targets and either Si (100) or NaCl as substrates. The bi-layer thickness was maintained around 16 nm with Ti constituting 12% of the total. The substrate was alternately moved below the Al and Ti targets for the purpose of deposition. The as-deposited film on the substrate and NaCl salts were annealed at 400°C for periods between 1 and 24 h in a vacuum (10−5 torr) furnace.

Type
Thin Films/Coatings
Copyright
Copyright © Microscopy Society of America

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References

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