Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-28T18:14:25.640Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructural Evaluation of Degradation Mechanisms in Thermally Treated TaSiN Diffusion Barriers for Cu Interconnects

Published online by Cambridge University Press:  01 August 2004

Hans-Juergen Engelmann ,
RenË Huebner ,
Michael Hecker ,
Norbert Mattern ,
Christian Wenzel ,
Ehrenfried Zschech  and
Klaus Wetzig
Hans-Juergen Engelmann
Affiliation:
AMD Saxony , Dresden, Germany
RenË Huebner
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
Michael Hecker
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
Norbert Mattern
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
Christian Wenzel
Affiliation:
Dresden University of Technology, Dresden, Germany
Ehrenfried Zschech
Affiliation:
AMD Saxony , Dresden, Germany
Klaus Wetzig
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
Get access

Extract

Extended abstract of a paper presented at Microscopy and Microanalysis 2004 in Savannah, Georgia, USA, August 1–5, 2004.

Type
Research Article
Information
Microscopy and Microanalysis , Volume 10 , Issue S02 , August 2004 , pp. 616 - 617
Copyright
© 2004 Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)