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Microstructural Comparison of Lead-Free Solder (Bi5-Ag3-Cu0.5-Sn) Prepared by Mechanical Alloying and Casting Route

Published online by Cambridge University Press:  01 August 2005

C Carreño-Gallardo ,
I Estrada-Guel  and
R Martínez-Sánchez
C Carreño-Gallardo
Affiliation:
Centro de Investigación en Materiales Avanzados,Mexico
I Estrada-Guel
Affiliation:
Centro de Investigación en Materiales Avanzados,Mexico
R Martínez-Sánchez
Affiliation:
Centro de Investigación en Materiales Avanzados,Mexico

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2005 in Honolulu, Hawaii, USA, July 31--August 4, 2005

Type
Research Article
Information
Microscopy and Microanalysis , Volume 11 , Issue S02 , August 2005 , pp. 1848 - 1849
Copyright
© 2005 Microscopy Society of America