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MicroStamping for Improved Speckle Patterns to Enable Digital Image Correlation

Published online by Cambridge University Press:  23 September 2015

Andrew H. Cannon ,
Jacob D. Hochhalter ,
Alberto W. Mello ,
Geoffrey F. Bomarito  and
Michael D. Sangid
Andrew H. Cannon
Affiliation:
1900 Engineering, LLC, Clemson, SC, USA.
Jacob D. Hochhalter
Affiliation:
NASA Langley, Durability, Damage Tolerance, and Reliability Branch, Hampton, VA, USA.
Alberto W. Mello
Affiliation:
Purdue University, School of Aeronautics and Astronautics, West Lafayette, IN, USA.
Geoffrey F. Bomarito
Affiliation:
NASA Langley, Durability, Damage Tolerance, and Reliability Branch, Hampton, VA, USA.
Michael D. Sangid
Affiliation:
Purdue University, School of Aeronautics and Astronautics, West Lafayette, IN, USA.

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 21 , Supplement S3: Proceedings of Microscopy & Microanalysis 2015 , August 2015 , pp. 451 - 452
Copyright
Copyright © Microscopy Society of America 2015 

References

[1] Cannon, AH & King, WP, Journal of Micromechanics and Microengineering 19 (2009). p. 1–6.Google Scholar
[2] Cannon, AH, Maguire, MC & Hochhalter, JD, US Patent Application 62116742 (2015.Google Scholar
[3] Gupta, VK, Willard, SA, Hochhalter, JD & Smith, SW, ASTM Materials Performance and Characterization 4 (2014). p 1–27.Google Scholar
[4] Abuziad, W, Sangid, MD, Carroll, J, Sehitoglu, H & Lambros, J, Journal of the Mechanics and Physics of Solids 60 (2012). p. 1201–1220.Google Scholar
[5] JDH and GFB would like to thank funding from the NARI Seedling Project.MDS and AWM would like to thank support from the Office of Naval Research, N00014-14-1-0544 and DARPA, N66001-14-1-4041. The authors acknowledge WW, TM, and MM for stimulating conversations about this topic..Google Scholar