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Micro-Mechanical In Situ Measurements in Thin Film Systems Regarding the Determination of Residual Stress, Fracture Properties and Interface Toughness

Published online by Cambridge University Press:  04 August 2017

R. Konetschnik ,
D. Kiener ,
D. Kozic ,
H.-P. Ganser  and
R. Brunner
R. Konetschnik
Affiliation:
Department Materials Physics, Montantuniversitaet Leoben, Leoben, Austria
D. Kiener
Affiliation:
Department Materials Physics, Montantuniversitaet Leoben, Leoben, Austria
D. Kozic
Affiliation:
Materials Center Leoben Forschung GmbH, Leoben, Austria
H.-P. Ganser
Affiliation:
Materials Center Leoben Forschung GmbH, Leoben, Austria
R. Brunner
Affiliation:
Materials Center Leoben Forschung GmbH, Leoben, Austria

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 23 , Supplement S1: Proceedings of Microscopy & Microanalysis 2017 , July 2017 , pp. 750 - 751
Copyright
© Microscopy Society of America 2017 

References

[1] Arden, W., et al‘More-than-Moore' White Paper, “International Technical Roadmap for Semiconductors, 2010.Google Scholar
[2] Treml, R., et al, Acta Materialia 103 2016). p. 616.Google Scholar
[3] Treml, R., et al, Extreme Mechanics Letters 8 2016). p. 235.Google Scholar
[4] Financial support from the Austrian Federal Government (in particular from Bundesministerium für Verkehr, Innovation und Technologie and Bundesministerium für Wissenschaft, Forschung und Wirtschaft) represented by Österreichische Forschungsförderungsgesellschaft mbH and the Styrian and the Tyrolean Provincial Government, represented by Steirische Wirtschaftsförderungsgesellschaft mbH and Standortagentur Tirol, within the framework of the COMET Funding Programme (No. 837900) is also gratefully acknowledged.Google Scholar