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Measuring Antiferromagnetism at the Angstrom Scale using 4D-STEM

Published online by Cambridge University Press:  22 July 2022

Jeffrey Huang ,
Kayla Nguyen ,
Manohar Karigerasi ,
Kisung Kang ,
André Schleife ,
Daniel Shoemaker ,
David Cahill ,
Jian-Min Zuo  and
Pinshane Huang
Jeffrey Huang
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
Kayla Nguyen
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
Manohar Karigerasi
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
Kisung Kang
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
André Schleife
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
Daniel Shoemaker
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
David Cahill
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
Jian-Min Zuo
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States
Pinshane Huang
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, United States

Abstract

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Type
Developments of 4D-STEM Imaging - Enabling New Materials Applications
Information
Microscopy and Microanalysis , Volume 28 , Supplement S1 , August 2022 , pp. 474 - 475
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Copyright
Copyright © Microscopy Society of America 2022

References

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This work was supported by AFOSR grant number AF FA9550-20-1-0302 and NSF-MRSEC award number DMR-1720633. Experiments were carried out in the Cornell Center for Materials Research Shared Facilities (supported through the NSF MRSEC program (DMR-1719875)) and in the Materials Research Laboratory Central Research Facilities at the University of Illinois.Google Scholar