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Investigation of Medium to High Strain Deformation Microstructures Using an Automated Electron Backscattering Pattern (EBSP) System

Published online by Cambridge University Press:  02 July 2020

A. Godfrey ,
N. C. Krieger Lassen ,
D. A. Hughes  and
D. Juul Jensen
A. Godfrey
Affiliation:
Center for Materials and Applied Mechanics,Sandia National Laboratories, Livermore, CA, 94550, U.S.A.
N. C. Krieger Lassen
Affiliation:
Materials Department, Risø National Laboratory, Roskilde, Denmark.
D. A. Hughes
Affiliation:
Center for Materials and Applied Mechanics,Sandia National Laboratories, Livermore, CA, 94550, U.S.A.
D. Juul Jensen
Affiliation:
Materials Department, Risø National Laboratory, Roskilde, Denmark.
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Extract

The speed of automated EBSP orientation gathering has now increased to a point where it is possible to examine large areas of deformed material at a resolution close to the length scale of the dislocation substructures involved (typically <1μm for strains of greater than ∊= l). Investigation of such deformed samples invariably gives rise to diffraction images of low quality and to many double patterns. To assist in a critical selection of the data, it is usual to store a measure of the indexing confidence for each point. Here we describe how deformed samples, which provide the appropriate range of pattern qualities, can be used to calibrate acceptance criteria for unsupervised EBSP measurements on deformation microstructures. An application in the use of such criteria is also described.

Two crystals, chosen with orientations that are known to develop a well defined texture spread during deformation, were channel die deformed to a strain of ∊=1.5 (78% reduction).

Type
New Trends in Scanning Electron Microscopy and Microanalysis
Information
Microscopy and Microanalysis , Volume 4 , Issue S2: Proceedings: Microscopy & Microanalysis '98, Microscopy Society of America 56th Annual Meeting, Microbeam Analysis Society 32nd Annual Meeting, Atlanta, Georgia July 12-16, 1998 , July 1998 , pp. 280 - 281
Copyright
Copyright © Microscopy Society of America

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References

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5. Part of this work was supported by the U.S. Department of Energy, Office of Basic Sciences under contract number DE-AC04-94AL85000.Google Scholar