Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-28T13:46:27.297Z Has data issue: false hasContentIssue false
  • English
  • Français

Intermixing in Ni/Al multilayer thin films

Published online by Cambridge University Press:  21 August 2009

S. Simões ,
F. Viana ,
A. S. Ramos ,
M. T. Vieira  and
M. F. Vieira
S. Simões
Affiliation:
CEMUC, Dep. de Engenharia Metalúrgica e Materiais, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal
F. Viana
Affiliation:
CEMUC, Dep. de Engenharia Metalúrgica e Materiais, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal
A. S. Ramos
Affiliation:
CEMUC, Departamento Engenharia Mecãnica, Faculdade de Ciências e Tecnologia da
M. T. Vieira
Affiliation:
CEMUC, Departamento Engenharia Mecãnica, Faculdade de Ciências e Tecnologia da
M. F. Vieira
Affiliation:
CEMUC, Dep. de Engenharia Metalúrgica e Materiais, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal

Abstract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

Self-propagating exothermic reactions are known to occur in multilayer films with alternating layers of a transition metal and a light element. The high velocity of these reactions, associated with high heat release rate, convert these systems in a unique heat source. The possibility of tailoring such a heat source to meet the needs of a particular process is very attractive to applications such as brazing or solid-state diffusion bonding. The solid state reactions occurring in Ni and Al multilayer thin films, produced by d.c. magnetron sputtering with bilayer thickness (period) of 5, 14 and 30 nm, were studied by differential scanning calorimetry (DSC). DSC results demonstrated that reaction temperature and heat released increase with the period of Ni/Al multilayer thin films.

Type
Materials Sciences
Information
Microscopy and Microanalysis , Volume 15 , Supplement S3 , July 2009 , pp. 75 - 76
Copyright
Copyright © Microscopy Society of America 2009