Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-24T19:35:30.420Z Has data issue: false hasContentIssue false
  • English
  • Français

In-Situ Low Energy Ion Milling with a FIB-SEM for TEM lift-out Sample Preparation of Copper Damascene Structures Fabricated with Low k porous SiLKTM Semiconductor Dielectric

Published online by Cambridge University Press:  24 July 2003

E. R. Beach ,
S. J. Rozeveld ,
C. J. Wood ,
M. V. Moore  and
J. Waeterloos
E. R. Beach
Affiliation:
The Dow Chemical Company, Analytical Sciences, 1897 Building, Midland, MI 48667
S. J. Rozeveld
Affiliation:
The Dow Chemical Company, Analytical Sciences, 1897 Building, Midland, MI 48667
C. J. Wood
Affiliation:
The Dow Chemical Company, Analytical Sciences, 1897 Building, Midland, MI 48667
M. V. Moore
Affiliation:
FEI Company, 7451 NW Evergreen Parkway, Hillsboro, OR 97124
J. Waeterloos
Affiliation:
The Dow Chemical Company, on assignment at the Interuniversity Microelectronics Center (IMEC), Leuven, Belgium

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 9 , Issue S02 , August 2003 , pp. 874 - 875
Copyright
Copyright © Microscopy Society of America 2003