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FIB sample preparation for X-ray microscopy and ROI target cross-sectioning

Published online by Cambridge University Press:  25 July 2016

Ehrenfried Zschech ,
Jürgen Gluch ,
Rüdiger Rosenkranz ,
Yvonne Standke  and
Sven Niese
Ehrenfried Zschech
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Jürgen Gluch
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Rüdiger Rosenkranz
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Yvonne Standke
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany
Sven Niese
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Department Nanoelectronic Materials and Nanoanalysis, Dresden, Germany now with AXO Dresden GmbH, Dresden, Germany

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 22 , Supplement S3: Proceedings of Microscopy & Microanalysis 2016 , July 2016 , pp. 168 - 169
Copyright
© Microscopy Society of America 2016 

References

References:

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[3] Knickerbocker, J. U., Kong, L. W., Niese, S., Diebold, A. & Zschech, E. “3D Interconnect Technology”. in “Advanced Interconnects for ULSI Technology” (Eds. M. Baklanov, P. S. Ho & E. Zschech, (John Wiley & Sons Chichester (2012). pp. 437–502.Google Scholar
[4] Kwakman, L., Franz, G., Taklo, M., Klumpp, A. & Ramm, P. “Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system”. AIP Conf. Proc 1395 (2011) 269.Google Scholar
[5] Stegmann, H., Domer, H., Rosenkranz, R. & Zschech, E. “Efficient Target Preparation by Combined Pulsed Laser Ablation and FIB Milling”. Microscopy and Microanalysis 17 (2011) 658–659.CrossRefGoogle Scholar