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Effect Of Capping Layer During Annealing of Low-Dose Lowenergy Simox Materials

Published online by Cambridge University Press:  02 July 2020

B. Johnson
Affiliation:
Dept. of Materials Science and Engineering, University of Arizona, Tucson, AZ85721
P. Anderson
Affiliation:
Dept. of Materials Science and Engineering, University of Arizona, Tucson, AZ85721
Y. Tan
Affiliation:
Dept. of Materials Science and Engineering, University of Arizona, Tucson, AZ85721
S. Seraphin
Affiliation:
Dept. of Materials Science and Engineering, University of Arizona, Tucson, AZ85721
M. Anc
Affiliation:
Ibis Technology Corporation, Danvers, MA01923
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Extract

Ultra-thin Silicon-On-Insulator (SOI) materials are becoming increasingly attractive for fabrication of ultra-large scale integrated (ULSI) devices due to their performance, speed, and power reduction advantages [1]. In SIMOX (Separation by IMplanted OXygen) materials, extensive damage can be repaired by high-temperature annealing in an argon ambient. A small percentage of oxygen is added to give a sufficient oxygen partial pressure to prevent formation of silicon monoxide lumps and subsequent pits [2]. Capping the sample surface to prevent external thermal oxidation during annealing is important to preserve the thickness of the top silicon layer. This is particularly critical for the ultra-thin SIMOX produced by the low-dose low-energy process. However, the surface capping also affects the formation of the buried oxide (BOX). To study this effect, two sets of samples implanted at the same doses of 1.5, 2.0, 2.5, and 3.0x 1017O+ /cm2 at 65keV were annealed with or without protective cap on the sample surface.

Type
Semiconductors
Copyright
Copyright © Microscopy Society of America

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References

References:

1.Colinge, J-P., MRS Bulletin, 23, 16, 1998CrossRefGoogle Scholar
2.White, A.E. et al., Appl. Phys. Lett., 50, 19, 1987CrossRefGoogle Scholar
3. This research is supported by the University of Arizona Research Foundation and Ibis Technology Corporation.Google Scholar