Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-28T16:41:30.890Z Has data issue: false hasContentIssue false
  • English
  • Français

Defect Characterization using Transmission Scanning Electron Microscopy

Published online by Cambridge University Press:  01 August 2018

Patrick Callahan ,
Jean-Charles Stinville ,
Eric Yao ,
McLean P. Echlin ,
Jungho Shin ,
Fulin Wang ,
Marc De Graef ,
Tresa M. Pollock  and
Daniel S. Gianola
Patrick Callahan
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA
Jean-Charles Stinville
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA
Eric Yao
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA
McLean P. Echlin
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA
Jungho Shin
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA
Fulin Wang
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA
Marc De Graef
Affiliation:
Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, USA
Tresa M. Pollock
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA
Daniel S. Gianola
Affiliation:
Materials Department, University of California Santa Barbara, Santa Barbara, USA

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 1836 - 1837
Copyright
© Microscopy Society of America 2018 

References

[1] Phillips, P., Brandes, M., Mills, M. De Graef, M. Ultramicroscopy 111 2011) p. 1483.Google Scholar
[2] Holm, J. Keller, R. Microscopy Today 25 2017) p. 12.Google Scholar
[3] Callahan, P.G., Stinville, J.-C., Yao, E., Echlin, M.P., Titus, M.S., De Graef, M., Gianola, D.S. Pollock, T.M. Ultramicroscopy 186 2018) p. 49.Google Scholar
[4 ] The authors acknowledge funding from the NSF MRSEC Program through DMR 1720256 (IRG-1). The research reported here made use of shared facilities of the UCSB MRSEC (NSF DMR 1720256), a member of the Materials Research Facilities Network (www.mrfn.org).Google Scholar