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Combination of Soft X-Ray Microscopy with In-Situ Mechanical Testing to Image Crack Propagation in Microchips

Published online by Cambridge University Press:  10 August 2018

Kristina Kutukova ,
Zhongquan Liao ,
Stephan Werner ,
Peter Guttmann ,
Yvonne Standke ,
Jurgen Gluch ,
Gerd Schneider  and
Ehrenfried Zschech
Kristina Kutukova*
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Zhongquan Liao
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Stephan Werner
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-StraBe 5, 12489 Berlin, Germany
Peter Guttmann
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-StraBe 5, 12489 Berlin, Germany
Yvonne Standke
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Jurgen Gluch
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
Gerd Schneider
Affiliation:
Helmholtz-Zentrum Berlin, Albert-Einstein-StraBe 5, 12489 Berlin, Germany
Ehrenfried Zschech
Affiliation:
Fraunhofer Institute for Ceramic Technologies and Systems, Maria-Reiche-StraBe 2, 01109 Dresden, Germany
*
*[email protected]

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S2: Proceedings of the 14th International Conference on X-ray Microscopy (XRM2018) , August 2018 , pp. 438 - 439
Copyright
© Microscopy Society of America 2018 

References

References:

[1] Rehbein, S., et al, Optics Express 20, 5830–5839, 2012.Google Scholar
[2] Kutukova, K., et al, MRS Advances, submitted 2018.Google Scholar
[3] Grill, A., et al, Appl. Phys. Rev. 1, 011306 2014.Google Scholar
[4] Natarajan, S., et al, IEEE International Electron Devices Meeting (IEDM), December 2014, San Francisco/CA (2014).Google Scholar
[5] Zhang, X., et al, AIP Conf. Proc. 1143, 197–203, 2009.Google Scholar
[6] Kutukova, K., et al, International FCMN conference, March 2017, Monterey/CA (2017).Google Scholar
[7] The authors thank Oden Warren and Douglas Stauffer (both with Bruker Corporation, Billerica/MA, USA) as well as Martin Gall, Andre Clausner and Christoph Sander (all with Fraunhofer IKTS Dresden, Germany) for helpful discussions. Financial support from SRC under Member-Specific Research Contract P30697 is greatly appreciated.Google Scholar