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Chemistry and Bonding at {222}Mgo/Cu Heterophase Interfaces
Published online by Cambridge University Press: 02 July 2020
Extract
Adhesion at ceramic/metal (C/M) interfaces often controls the macroscopic behavior of materials containing metallic and ceramic phases, and experimental studies of bonding at C/M interfaces have recently been reported. Electron energy loss spectroscopy (EELS) offers unique opportunities to examine bonding at interfaces on an atomic scale. The EELS near edge fine structure is sensitive to local atomic arrangements and thus can be used as a coordination fingerprint. Much more can be done, however, by analyzing the connection between the EELS fine structure, the underlying local electronic structure and the cohesive energy of an interface to gain a deeper understanding of the nature of the adhesion at the interface.
In this work, we apply high spatial-resolution EELS instrument to study {222} MgO/Cu interfaces produced by internal oxidation. We determine interfacial chemistry of this interface with subnanometer resolution (Fig. 1) and use EELS to directly measure the electronic states pertaining to the interface
- Type
- Atomic Structure and Mechanisms at Interfaces in Materials
- Information
- Microscopy and Microanalysis , Volume 3 , Issue S2: Proceedings: Microscopy & Microanalysis '97, Microscopy Society of America 55th Annual Meeting, Microbeam Analysis Society 31st Annual Meeting, Histochemical Society 48th Annual Meeting, Cleveland, Ohio, August 10-14, 1997 , August 1997 , pp. 647 - 648
- Copyright
- Copyright © Microscopy Society of America 1997
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[8] This work was supported by DOE Giants DEFG02-87ER45322 and DEFG02-96ER45597. L. H. Yang, was supported by the DOE at LLNL under contract no. W-7405-ENG-48.Google Scholar
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