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Characterization of Ni/Ti interlayer foil to assist diffusion bonding.

Published online by Cambridge University Press:  10 September 2015

O Emadinia ,
S Simões ,
F Viana  and
M.F Vieira
O Emadinia*
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
S Simões
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
F Viana
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
M.F Vieira
Affiliation:
CEMUC Department of Metallurgy and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
*
E-mail: [email protected]

Abstract

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Type
Material Sciences
Information
Microscopy and Microanalysis , Volume 21 , Supplement S6: Introduction to the SPMicros Special Issue from the XLVII Annual Congress , August 2015 , pp. 120 - 121
Copyright
Copyright © Microscopy Society of America 2015 

References

[1]Simões, S., et al. (2013). Materials Science 48, 7718–7727.Google Scholar