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Characterization of Grain Structure and Porosity in Selective Laser Melted Cu-4.3Sn for Enhancing Electrical Connector Fabrication

Published online by Cambridge University Press:  23 September 2015

Anthony P. Ventura ,
C. Austin Wade ,
Wojciech Z. Misiolek ,
Masashi Watanabe ,
Greg Pawlikowski  and
Martin Bayes
Anthony P. Ventura
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
C. Austin Wade
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
Wojciech Z. Misiolek
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
Masashi Watanabe
Affiliation:
Lehigh University, Materials Science and Engineering Department, Bethlehem, PA, USA
Greg Pawlikowski
Affiliation:
TE Connectivity, Harrisburg, PA, USA
Martin Bayes
Affiliation:
TE Connectivity, Harrisburg, PA, USA

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 21 , Supplement S3: Proceedings of Microscopy & Microanalysis 2015 , August 2015 , pp. 133 - 134
Copyright
Copyright © Microscopy Society of America 2015 

References

[1] Davis, J.R. in “Copper and Copper Alloys: ASM Specialty Handbook”, ed. 1 (ASM International, Materials Park) p. 3.Google Scholar
[2] Thijs, L., etal., Acta Materialia 58 (2010). p. 3303.CrossRefGoogle Scholar
[3] Thijs, L., et al., Acta Materialia 61 (2013). p. 1809.CrossRefGoogle Scholar
[4] Niendorf, T., et al., Metallurgical and Materials Transactions 44B (2013). p. 794.CrossRefGoogle Scholar
[5] The authors would like to acknowledge the joint funding from the Research for Advanced Manufacturing in Pennsylvania program and TE Connectivity, Ltd.Google Scholar