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Characterization of a Mo Diffusion Barrier for Au/Sn Solder Bonding of Micro/Optoelectronic Devices to Carriers

Published online by Cambridge University Press:  01 August 2002

A. He  and
D.G. Ivey
A. He
Affiliation:
Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G6
D.G. Ivey
Affiliation:
Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G6

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 8 , Issue S02 , August 2002 , pp. 1292 - 1293
Copyright
Copyright © Microscopy Society of America 2002