Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-02T23:39:47.717Z Has data issue: false hasContentIssue false
  • English
  • Français

Beware of Artifacts When Characterizing Nanometer Device Features Smaller than a TEM Lamella Thickness in Semiconductor Wafer-foundries

Published online by Cambridge University Press:  27 August 2014

Wayne Zhao ,
Hugh Porter ,
Raghaw Rai ,
Esther (PY) Chen  and
Jeremy Russell
Wayne Zhao
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, Technology Development, GLOBALFOUNDRIES, Malta, New York, USA
Hugh Porter
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, Technology Development, GLOBALFOUNDRIES, Malta, New York, USA
Raghaw Rai
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, Technology Development, GLOBALFOUNDRIES, Malta, New York, USA
Esther (PY) Chen
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, Technology Development, GLOBALFOUNDRIES, Malta, New York, USA
Jeremy Russell
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, Technology Development, GLOBALFOUNDRIES, Malta, New York, USA

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 20 , Supplement S3: Proceedings of Microscopy & Microanalysis 2014 , August 2014 , pp. 1000 - 1001
Copyright
Copyright © Microscopy Society of America 2014 

References

[1] Zhao, W., et al., Microscopy & Microanalysis, Vol. 19(Supplement 2), (2013), pp.902~903.Google Scholar
[2] Zhao, W., et al., Proc. 38th International Symposium for Testing and Failure Analysis (2012), pp. 347~355.Google Scholar
[3] Zhao, W. & Proc, Symp. the Material Research Society, 2002 Fall Meeting (2002), Vol. 738, pp. G7.15.1~6.Google Scholar