No CrossRef data available.
Article contents
A Best Known Method to Effectively Differentiate Elements with XEDS Peaks Overlapping for High-Volume Manufacturing of Semiconductor Device at Wafer Foundries
Published online by Cambridge University Press: 30 July 2021
Abstract
An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
![Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'](https://static.cambridge.org/content/id/urn%3Acambridge.org%3Aid%3Aarticle%3AS1431927621010916/resource/name/firstPage-S1431927621010916a.jpg)
- Type
- Microscopy and Microanalysis for Real World Problem Solving
- Information
- Copyright
- Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America
References
Siddiqui, S., Galatage, R., Zhao, W., et al. , Microelectronic Engineering, Volume 223, (2020), p. 111219.CrossRefGoogle Scholar
Gribelyuk, M. A., Fu, B., Zhao, W., Journal of Applied Physics, 125, (2019); pp. 165306Google Scholar
Zhao, W. and Wang, Y. Y., Microscopy & Microanalysis, Vol. 21 (Supplement 1), (2017), pp.1490-1491.CrossRefGoogle Scholar
Thanks to Irene Brooks for proof-reading, Gerald Walker for his skillfulness in TEM-prep and Long Men for screening the TEM sample; and Fab8 Management and Legal teams for supporting the publication clearance.Google Scholar