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Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development

Published online by Cambridge University Press:  01 August 2018

Tzu-Ting Chou ,
Rui-Wen Song  and
Jenq-Gong Duh
Tzu-Ting Chou
Affiliation:
Dept. of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.
Rui-Wen Song
Affiliation:
Dept. of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.
Jenq-Gong Duh
Affiliation:
Dept. of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan.

Abstract

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Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 618 - 619
Copyright
© Microscopy Society of America 2018