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Application of EFTEM and XEDS Elemental Mapping to Characterization of Nanometer Devices in Semiconductor Wafer-Foundries

Published online by Cambridge University Press:  23 September 2015

Wayne W. Zhao
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, GLOBALFOUNDRIES, Malta, New York, USA.
Michael Gribelyuk
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, GLOBALFOUNDRIES, Malta, New York, USA.
Jeremy D. Russell
Affiliation:
Engineering Analysis - Physical, Technology Development & Yield Engineering, GLOBALFOUNDRIES, Malta, New York, USA.

Abstract

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Type
Abstract
Copyright
Copyright © Microscopy Society of America 2015 

References

References:

[1] Zhao, W., et al., Microscopy & Microanalysis Vol. 20(Supplement 3) (2014). pp 362363.Google Scholar
[2] Zhao, W., Gribelyuk, M., et al., Proc. 38th International Symposium for Testing and Failure Analysis (2012). pp 347355.Google Scholar
[3] Zhao, W., Symp. Proc. the Material Research Society, Fall Meeting (2002), Vol. 738, pp. G7.15.l~6.Google Scholar
[4] Leapman, R. & Hunt, J., Microscopy, Microanalysis, Microstructure Vol. 2 (1991). pp 231244.Google Scholar
[5] Harrach, H., et al., Microscopy & Microanalysis Vol. 16(Supplement 2) (2010). pp 13121313.Google Scholar
[6] The authors wish to thank and acknowledge Derrick Franks for preparing this TEM sample..Google Scholar