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An SEM on a Chip

Published online by Cambridge University Press:  02 July 2020

D.A. Crewe  and
A.D. Feinerman
D.A. Crewe
Affiliation:
Department of Electrical Engineering and Computer Science, Microfabrication Applications Laboratory, University of Illinois at ChicagoChicago, Illinois, 60607
A.D. Feinerman
Affiliation:
Department of Electrical Engineering and Computer Science, Microfabrication Applications Laboratory, University of Illinois at ChicagoChicago, Illinois, 60607
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Extract

A silicon microfabrication technique has been applied toward the development of a Miniature Scanning Electron Microscope (MSEM). The fabrication technology is not only precise but is inexpensive compared to conventional methods of electron microscope construction and is easily extended to the construction of arrays of MSEMs for applications in high throughput e-beam lithography and wafer inspection.

An electrostatic electron lens consists of a series of planar electrodes with central apertures that are precisely aligned to and electrically isolated from one another. This structure is fabricated using silicon as the electrode material and Pyrex optical fibers as the insulators. The electrodes are fabricated on four inch (100) orientation silicon wafers that are patterned on both sides and anisotropically etched to form four orthogonal v-grooves and an open diaphragm with a circular aperture in the center. The apertures are formed by reactive ion etching. The wafers are then diced to create approximately 100 7 mm by 9 mm electrodes.

Type
Low Voltage SEM Imaging and Analysis for the Biological and Materials Sciences
Information
Microscopy and Microanalysis , Volume 3 , Issue S2: Proceedings: Microscopy & Microanalysis '97, Microscopy Society of America 55th Annual Meeting, Microbeam Analysis Society 31st Annual Meeting, Histochemical Society 48th Annual Meeting, Cleveland, Ohio, August 10-14, 1997 , August 1997 , pp. 1217 - 1218
Copyright
Copyright © Microscopy Society of America 1997

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References

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2. Feinerman, A.D. et. al.'Precision Aligning and Bonding of Silicon Die", Patterning Science and Technology II/Interconnection and Contact Metalization for ULSI, PV92-6, pp. 115-125, edited by W. Greene, G.J. Hefferon, L.K. White, T.L. Herndon and A.L. Wu, Electrochemical Society Proceedings (October, 1991).Google Scholar

3. Crewe, D.A. et. al., “Initial Tests of a Micromachined SEM”, J. Vac. Sei.& Technol. B, vol. 14, no. 6, pp. 3808–3812(1996).CrossRefGoogle Scholar