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An Evaluation of Beam-Damage Zone in Si Wafer Machined by Gatan MicroPREPTM Laser-Ablation

Published online by Cambridge University Press:  01 August 2018

Wayne Zhao ,
Corbin Bennett ,
Pradip Sairam Pichumani ,
Gerald Walker ,
Kevin Eaton ,
Michael Hassel Shearer ,
Laurent Dumas ,
Irene Brooks  and
Ying Wang
Wayne Zhao
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY.
Corbin Bennett
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY.
Pradip Sairam Pichumani
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY.
Gerald Walker
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY.
Kevin Eaton
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY.
Michael Hassel Shearer
Affiliation:
Gatan, Pleasanton, CA.
Laurent Dumas
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY.
Irene Brooks
Affiliation:
Physical Failure Analysis, Center for Complex Analysis, Characterization Group, Fab8, GLOBALFOUNDRIES, Malta, NY.
Ying Wang
Affiliation:
Gatan, Pleasanton, CA.

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 1146 - 1147
Copyright
© Microscopy Society of America 2018 

References

References:

[1] Zhao, W., et al, Microscopy & Microanalysis 20(S3 2014) p. 362.Google Scholar
[2] Wang, Y., et al IC Packaging. FCMN 2017) in print.Google Scholar
[3] Elswick, D., et al, FIB Workshop. Washington DC 2017.Google Scholar
[4] Thanks go to Andreas Meyer of GLOBALFOUNDRIES Fab1 for his insights and inspiring discussions, and Fab8 Management and Legal teams for supporting the publication clearance..Google Scholar