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AES and Related Techniques for Yield Improvement, Metrology and Development Support of ULSI Circuits Manufactured in ≤ 28nm CMOS Technology

Published online by Cambridge University Press:  27 August 2014

Kornelia Dittmar ,
Susanne Ohsiek ,
Christoph Klein ,
Martin Weisheit ,
Markus Lenski ,
Elke Erben ,
Dina Triyoso ,
Robert Binder ,
Joachim Metzger  and
Klaus Hempel
...Show all authors
Kornelia Dittmar
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Susanne Ohsiek
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Christoph Klein
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Martin Weisheit
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Markus Lenski
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Elke Erben
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Dina Triyoso
Affiliation:
GLOBALFOUNDRIES Fab 8, Malta, USA
Robert Binder
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Joachim Metzger
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Klaus Hempel
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany
Hans-Jürgen Engelmann
Affiliation:
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 20 , Supplement S3: Proceedings of Microscopy & Microanalysis 2014 , August 2014 , pp. 2054 - 2055
Copyright
Copyright © Microscopy Society of America 2014 

References

[1] Dittmar, K, et al, ECASIA (2011).Google Scholar
[2] Dittmar, K, et al, LEIS Workshop (2012).Google Scholar
[3] This work was financially supported by the Sächsische Aufbaubank (SAB), Project No. 13444.Google Scholar