Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-02T22:04:11.545Z Has data issue: false hasContentIssue false
  • English
  • Français

Advanced Physical Failure Analysis Techniques Using 3D Rotation Imaging from Plane-View TEM Sample

Published online by Cambridge University Press:  08 April 2017

H-J Kang ,
J-G Gwak ,
T-S Park ,
T-S Back ,
H-J Kim  and
O Han
H-J Kang
Affiliation:
Hynix Semiconductor Inc, Korea
J-G Gwak
Affiliation:
Hynix Semiconductor Inc, Korea
T-S Park
Affiliation:
Hynix Semiconductor Inc, Korea
T-S Back
Affiliation:
Hynix Semiconductor Inc, Korea
H-J Kim
Affiliation:
Hynix Semiconductor Inc, Korea
O Han
Affiliation:
Hynix Semiconductor Inc, Korea

Extract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

Type
Abstract
Information
Microscopy and Microanalysis , Volume 17 , Supplement S2 , July 2011 , pp. 634 - 635
Copyright
Copyright © Microscopy Society of America 2011