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TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film

Published online by Cambridge University Press:  01 October 2010

S. Simões ,
F. Viana ,
A.S. Ramos ,
M.T. Vieira  and
M.F. Vieira
S. Simões*
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
F. Viana
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
A.S. Ramos
Affiliation:
CEMUC, Department of Mechanical Engineering, University of Coimbra, R. Luís Reis Santos, 3030-788 Coimbra, Portugal
M.T. Vieira
Affiliation:
CEMUC, Department of Mechanical Engineering, University of Coimbra, R. Luís Reis Santos, 3030-788 Coimbra, Portugal
M.F. Vieira
Affiliation:
CEMUC, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
*
Corresponding author. E-mail: [email protected]
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Abstract

Reactive multilayer thin films that undergo highly exothermic reactions are attractive choices for applications in ignition, propulsion, and joining systems. Ni/Al reactive multilayer thin films were deposited by dc magnetron sputtering with a period of 14 nm. The microstructure of the as-deposited and heat-treated Ni/Al multilayers was studied by transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) in plan view and in cross section. The cross-section samples for TEM and STEM were prepared by focused ion beam lift-out technique. TEM analysis indicates that the as-deposited samples were composed of Ni and Al. High-resolution TEM images reveal the presence of NiAl in small localized regions. Microstructural characterization shows that heat treating at 450 and 700°C transforms the Ni/Al multilayered structure into equiaxed NiAl fine grains.

Keywords

nickel aluminidesmetallic multilayerexothermic reactionfocused ion beamlift-out techniquetransmission electron microscopy
Type
Special Section from Portugal Meeting
Information
Microscopy and Microanalysis , Volume 16 , Issue 6 , December 2010 , pp. 662 - 669
Copyright
Copyright © Microscopy Society of America 2010

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References

REFERENCES

Barmak, K., Michaelsen, C. & Lucadamo, G. (1997). Reactive phase formation in sputter-deposited Ni/Al multilayer thin films. J Mater Res 12, 133–146.CrossRefGoogle Scholar
Bassani, M.H.S., Perepezko, J.H., Edelstein, A.S. & Everett, R.K. (1997). Initial phase evolution during interdiffusion reactions. Scr Mater 37, 227–232.CrossRefGoogle Scholar
Blobaum, K.J., Van Heerden, D., Gavens, A.J. & Weihs, T.P. (2003). Al/Ni formation reactions: Characterization of the metastable Al9Ni2 phase and analysis of its formation. Acta Mater 51, 3871–3887.CrossRefGoogle Scholar
Edelstein, A.S., Everett, R.K., Richardson, G.Y., Qadri, S.B., Altman, E.I., Foley, J.C. & Perepezko, J.H. (1994). Intermetallic phase formation during annealing of AI/Ni multilayers. J Appl Phys 76, 7850–7859.CrossRefGoogle Scholar
Gavens, A.J., Van Heerden, D., Mann, A.B., Reiss, M.E. & Weihs, T.P. (2000). Effect of intermixing on self-propagating exothermic reactions in Al/Ni nanolaminate foils. J Appl Phys 87, 1255–1263.CrossRefGoogle Scholar
Hu, R. & Nash, P. (2005). The enthalpy of formation of NiAl. J Mater Sci 40, 1067–1069.CrossRefGoogle Scholar
Lee, S.-G., Kim, S.-P., Lee, K.-R. & Chung, Y.-C. (2005). Atomic-level investigation of interface structure in Ni-Al multilayer system: Molecular dynamics simulation. J Magn Magn Mater 286, 394–398.CrossRefGoogle Scholar
Le Guen, K., Gamblin, G., Jonnard, P., Salou, M., Youssef, J.B., Rioual, S. & Rouvellou, B. (2009). Spectroscopic study of interfaces in Al/Ni periodic multilayers. Eur Phys J-Appl Phys 45, 20502.CrossRefGoogle Scholar
Ma, E., Nicolet, M.A. & Nathan, M. (1989). NiAl3 formation in Al/Ni thin-film bilayers with and without contamination. J Appl Phys 65, 2703–2710.CrossRefGoogle Scholar
Ma, E., Thompson, C.V. & Clevenger, L.A. (1991). Nucleation and growth during reactions in multilayer Al/Ni films: The early stage of Al3Ni formation. J Appl Phys 69, 2211–2218.CrossRefGoogle Scholar
Ma, E., Thompson, C.V., Clevenger, L.A. & Tu, K.N. (1990). Self-propagating explosive reactions in Al/Ni multilayer thin film. J Appl Phys 57, 2211–2218.Google Scholar
Matsuura, K.K. & Kudoh, M. (2001). Joining between NiAl and heat resistant alloys by reactive casting. Adv Eng Mater 3, 311–314.3.0.CO;2-N>CrossRefGoogle Scholar
Mayer, J., Giannuzzi, L.A., Kamino, T. & Michael, J. (2007). Preparation and FIB-induced damage. MRS Bull 32, 400–407.CrossRefGoogle Scholar
Michaelsen, C., Barmak, K. & Weihs, T.P. (1997). Investigating the thermodynamics and kinetics of thin film reactions by differential scanning calorimetry. J Appl Phys 30, 3167–3186.Google Scholar
Michaelsen, C., Lucadamo, G. & Barmak, K. (1996). The early stages of solid-state reactions in Ni/Al multilayer films. J Appl Phys 80, 6689–6698.CrossRefGoogle Scholar
Michel, J.R. (2006). Gallium phase formation in Cu during 30kV Ga+ FIB milling. Microsc Microanal 12(S2), 1248–1249 (CD-ROM).CrossRefGoogle Scholar
Miura, S., Terada, Y., Suzuki, T., Liu, C.T. & Mishima, Y. (2000). Thermal conductivity of Ni-Al powder compacts for reaction synthesis. Intermetallics 8, 151–155.CrossRefGoogle Scholar
Noro, J., Ramos, A.S. & Vieira, M.T. (2008). Intermetallic phase formation in nanometric Ni/Al multilayer thin films. Intermetallics 16, 1055–1058.CrossRefGoogle Scholar
Qiu, X. & Wang, J. (2007). Experimental evidence of two-stage formation of Al3Ni in reactive Ni/Al multilayer foils. Scr Mater 56, 1055–1058.CrossRefGoogle Scholar
Ramos, A.S., Vieira, M.T., Morgiel, J., Grzonka, J., Simões, S. & Vieira, M.F. (2009). Production of intermetallic compounds from Ti/Al and Ni/Al multilayer thin films—A comparative study. J Alloy Compd 484, 335–340.CrossRefGoogle Scholar
Salou, M., Rioual, S., Youssef, J.B., Dekadjevi, D.T., Pogossian, S.P., Jonnard, P., Le Guen, K., Gamblin, G. & Rouvellou, B. (2008). Inter-diffusion effects in as-deposited Al/Ni polycrystalline multi-layers. Surf Interface Anal 40, 1318–1321.CrossRefGoogle Scholar
Simões, S., Viana, F., Ramos, A.S., Vieira, M.T. & Vieira, M.F. (2008). Microstructure evolution during Ni/Al multilayer reactions. EMC 2008 14th European Microscopy Congress, Aachen, Germany, September 1–5, 2008, pp. 487–488.CrossRefGoogle Scholar
Simões, S., Viana, F., Ventzke, V., Koçak, M., Ramos, A.S., Vieira, M.T. & Vieira, M.F. (2010). Diffusion bonding of TiAl using Ni/Al multilayers. J Mater Sci 45, 4351–4357.CrossRefGoogle Scholar
Spolenak, R., Sauter, L. & Eberl, C. (2005). Reversible orientation-biased grain growth in thin metal films induced by a focused ion beam. Scr Mater 53, 1291–1296.CrossRefGoogle Scholar
Wang, J.J., Besnoin, E., Duckham, A., Spey, S.J., Reiss, M.E., Knio, O.M. & Weihs, T.P. (2004). Joining of stainless-steel specimens with nanostructured Al/Ni foils. J Appl Phys 95, 248–256.CrossRefGoogle Scholar
Zhu, H.X. & Abbaschian, R. (2003). Reactive processing of nickel-aluminide intermetallic compounds. J Mater Sci 38, 3861–3870.CrossRefGoogle Scholar