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Real Time Observations of Dislocation-Mediated Plasticity in the Epitaxial Aluminum (110) / Silicon (001) Thin Film System

Published online by Cambridge University Press:  02 July 2020

E.A. Stach ,
U. Dahmen  and
W.D. Nix
E.A. Stach
Affiliation:
National Center for Electron Microscopy, Lawrence Berkeley National Laboratory
U. Dahmen
Affiliation:
National Center for Electron Microscopy, Lawrence Berkeley National Laboratory
W.D. Nix
Affiliation:
Department of Materials Science and Mineral Engineering, Stanford University
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Extract

The mechanical behavior of metallic thin films on silicon plays a crucial role in the performance and reliability of microelectronic devices. A substantial body of research has focused on experimental methods for determining the mechanical properties of these systems as well as their response to thermomechanical stimuli. Of particular interest is a fundamental understanding of the how these films respond to the thermal expansion stresses that develop during typical microelectronic device fabrication steps.

In this work, we present a series of real time in-situ transmission electron microscopy observations of the thermomechanical response of a model metal film on silicon system. Physical vapor deposition of approximately 50 nm of aluminum onto a clean Si substrate held at 280 °C results in the creation of an epitaxial bicrystalline film with two variants of Al (110) oriented grains. In order to observe a large, uniform area during in-situ TEM thermal cycling, the Si substrate used was a SIMOX structure composed of 300 nm of Si (001) over 370 nm of buried SiO2).

Type
Films and Coatings
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 438 - 439
Copyright
Copyright © Microscopy Society of America

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References

1 See, e.g. the series “Thin Films, Stresses and Mechanical Properties”, vols. 1-7, Materials Research Society Proceedings, Pittsburgh, PA.Google Scholar

2 Thangaraj, N., Westmacott, K.H. and Dahmen, U., Appl. Phys. Lett. 61, 37, 1992.CrossRefGoogle Scholar

3 Bahnck, D., Batstone, J. L., and Phillips, J. M., Mater. Res. Soc. Proc 115, 63, 1988; M. B. Ellington, ibid, p. 265.CrossRefGoogle Scholar

4 Hull, R., Appl. Phys. Lett. 63, 2291, 1993.CrossRefGoogle Scholar

This work is supported by the Director, Office of Energy Research, Office of Basic Energy Sciences, Materials Science Division of the U.S. Department of Energy under Contract No. DE-AC03-76SF000098